Patents by Inventor Huang-Chih Chen

Huang-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110291893
    Abstract: An antenna for transmitting a wireless signal is provided. The antenna includes a ground element, a short element and a transmitting element. The short element is connected to the ground element. The transmitting element is connected to the short element, wherein the transmitting element is a claw shaped structure, and the transmitting element includes a first section, a second section and an extending section, wherein an end of the first section is connected to the short element, and the other end of the first section is connected to ends of the second section and the extending section, and a first groove is formed between the first section and the second section, and a second groove is formed between the first section and the extending section.
    Type: Application
    Filed: December 31, 2010
    Publication date: December 1, 2011
    Applicant: WISTRON NEWEB CORP.
    Inventors: Huang-Chih Chen, Yung-Jinn Chen
  • Publication number: 20110102273
    Abstract: A dipole antenna is provided. The dipole antenna includes a signal line, a ground line, a substrate, a first radiation element and a second radiation element. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The first radiation element is disposed on the first surface and electrically connected to the signal line, wherein the first radiation element comprises a first connection portion and a first extending portion, the first extending portion comprises a first bending portion, the first bending portion forms a first section and a second section on the first extending portion, and the first section is connected to the first connection portion. The second radiation element is disposed on the second surface and electrically connected to the ground line, wherein the second radiation element comprises a second connection portion.
    Type: Application
    Filed: April 22, 2010
    Publication date: May 5, 2011
    Applicant: WISTRON NEWEB CORP.
    Inventors: Huang-Chih Chen, Chia Huang Shen, Yung-Jinn Chen
  • Publication number: 20100188297
    Abstract: An antenna is provided. The antenna includes a signal line, a ground line, a first radiation element and a second radiation element. The first radiation element is electrically connected to the signal line. The first radiation element includes a first U-shaped section and a first extension section. The signal line is connected to an end of the first U-shaped section, and the first extension section is connected to the other end thereof. The first U-shaped section includes a first notch toward a first direction. The second radiation element is electrically connected to the ground line. The second radiation element includes a second U-shaped section and a second extension section. The ground line is connected to an end of the second U-shaped section, and the second extension section is connected to the other end thereof. The second U-shaped section includes a second notch toward the first direction.
    Type: Application
    Filed: April 28, 2009
    Publication date: July 29, 2010
    Applicant: WISTRON NEWEB CORP.
    Inventors: Huang-Chih Chen, Jung-Jinn Chen
  • Publication number: 20090289646
    Abstract: A test probe pin is disclosed. The test probe has a plurality of probes, each of which has a probe tip surface coated with a nano-film of conducting polymer, and the thickness of the nano-film is about 1-20 nm. The probes coated with the nano-film are installed on a test fixture for testing IC components, so that the probes can efficiently provide excellent no-clean property and stabler electro-conductivity for lowering the cleaning frequency of the probes, enhancing the yield of IC component testing, increasing the utility rate of the test fixture, reducing the total testing cost, elongating the usage lifetime of the test probe, and reducing the cost of probe material. Thus, due to the nano-film of conducting polymer, the probes made of metal material can provide almost the same electro-conductivity as a traditional probe by only plating a gold layer of one fifth of original thickness, so that the cost of whole probe material can be reduced.
    Type: Application
    Filed: January 23, 2009
    Publication date: November 26, 2009
    Applicant: IPWORKS TECHNOLOGY CORP.
    Inventors: Been-long Chen, Huang-chih Chen
  • Publication number: 20090212805
    Abstract: A probe of a vertical probe card is disclosed. The probe has a probe tip and a surface region extended from the probe tip about 1-10 mil. The surface region is coated with a nano-film of high electro-conductive nano-material, and the thickness of the nano-film is about 1-20 nm. The nano-film of the probe can efficiently provide excellent no-clean property and higher electro-conductivity for lowering contact force and elongating usage lifetime of the probe of vertical probe card. Accordingly the yield of wafer testing can be improved, the frequency of cleaning probe can be lowered, and the total testing cost can be reduced.
    Type: Application
    Filed: July 22, 2008
    Publication date: August 27, 2009
    Applicant: IPWORKS TECHNOLOGY CORP.
    Inventors: Been-long Chen, Huang-chih Chen
  • Publication number: 20090212807
    Abstract: A probe of a cantilever probe card (Epoxy probe card) is disclosed. The probe has a tip and a surface region extended from the tip of the probe about 5-10 mil is coated with a nano-film of high electro-conductive nanomaterial. The thickness of the nano-film is about 1-20 nm. Through the coating process, the nano-film coated on the probe of the cantilever probe card can efficiently provide the excellent advantages of no-clean, stable electro-conductivity, minimum overdrive force and longer usage lifetime for the probe of cantilever probe card. Accordingly, the yield of wafer testing can be improved and the frequency of cleaning the probe can be decreased. Furthermore, the total testing cost can be reduced.
    Type: Application
    Filed: July 30, 2008
    Publication date: August 27, 2009
    Applicant: IPWORKS TECHNOLOGY CORP.
    Inventors: Been-long Chen, Huang-chih Chen
  • Patent number: D661251
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: June 5, 2012
    Assignee: Cyber Power System Inc.
    Inventors: Hsiung-Kuei Cheng, Huang-Chih Chen