Patents by Inventor Huang Lee
Huang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240157426Abstract: A forming tool has an upper portion composed of an upper forming die arranged between a first clamping element and a second clamping element, and a lower portion composed of a lower forming die arranged between a third clamping element and a fourth clamping element. The first clamping element and the third clamping element cooperate to exert a first clamping force on a workpiece; and the second clamping element and the fourth clamping element cooperate to exert a second clamping force on the workpiece. The upper forming die cooperates with the first and second clamping elements and the lower forming die cooperates with the third and fourth clamping elements to exert a lateral force on the workpiece when the first and second clamping forces are being exerted on the workpiece and when a vertical compressive force is being exerted upon the upper forming die and the lower forming die.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Joshua L. Solomon, Lu Huang, Hui-Ping Wang, Nathan Sigmund, Tae Hwa Lee, Blair E. Carlson
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Publication number: 20240158309Abstract: The invention provides a material surface treatment equipment, which is applied to a material substrate. The material surface treatment equipment includes a surface treatment device and at least one waveguide device. The surface treatment device is used to carry the material substrate to perform a surface treatment process. Each waveguide device is used for introducing electromagnetic waves to the material substrate to assist in performing the surface treatment process. Through the introduction of electromagnetic waves, the surface treatment process of the material substrate is easy to perform and can achieve the strengthening effect.Type: ApplicationFiled: December 15, 2022Publication date: May 16, 2024Inventors: TIEN-HSI LEE, JUN-HUANG WU, YU-SHENG CHIOU, SHU-CHENG LI, WEI-CHI HUANG, HSIN CHEN
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Publication number: 20240138102Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may cool the hardware components to dissipate heat from the hardware components. The data processing system may include a fan retention mechanism that facilitates orientation of positioning of cooling components used to dissipate the heat from the hardware components.Type: ApplicationFiled: October 19, 2022Publication date: April 25, 2024Inventors: CHIN-AN HUANG, JU-HAO LEE, MICHAEL ALBERT PERKS
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Patent number: 11967591Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.Type: GrantFiled: August 6, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
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Patent number: 11964259Abstract: A catalyst composition for hydrogenating 4,4?-methylenedianiline derivatives is provided. The catalyst composition includes a carrier including aluminum oxide and magnesium oxide, a rhodium-ruthenium active layer loaded on the surface of the carrier, and a solvent including an organic amine. The weight percentage of magnesium oxide in the carrier is between 12% and 30%. A method for preparing 4,4?-methylene bis(cyclohexylamine) derivatives using the catalyst composition is also provided.Type: GrantFiled: December 28, 2020Date of Patent: April 23, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Huang Chen, Jyun-Da Wu, Tzong-Shyan Lu, Ying-Chieh Lee
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Publication number: 20240127710Abstract: Disclosed are a system and method for automatically evaluating an essay. The system includes a structure analysis module configured to divide learning data and learner essay text in a predetermined structure analysis unit, generate structure tagging information for each structure analysis unit, and structure the learning data and the learner essay text by attaching the structure tagging information to the learning data and the learner essay text, a learning module configured to generate an essay evaluation model through learning by using essay text that is included in the structured learning data and the structure tagging information as an input value and using an evaluation score that is included in the structured learning data as a label, and an evaluation module configured to generate essay evaluation results using the essay evaluation model.Type: ApplicationFiled: April 18, 2023Publication date: April 18, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Minsoo CHO, Oh Woog KWON, Yoon-Hyung ROH, Ki Young LEE, Yo Han LEE, Sung Kwon CHOI, Jinxia HUANG
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Publication number: 20240112928Abstract: A trimming method is provided. The trimming method includes the following steps. A first wafer including a substrate and a device layer over a first side of the substrate is provided. The first wafer is bonded to a second wafer with the first side of the substrate facing toward the second wafer. An edge trimming process is performed to remove a trimmed portion of the substrate from a second side opposite to the first side vertically downward toward the first side in a first direction along a perimeter of the substrate, wherein the edge trimming process results in the substrate having a flange pattern laterally protruding from the device layer and laterally surrounding an untrimmed portion of the substrate along a second direction perpendicular to the first direction.Type: ApplicationFiled: January 10, 2023Publication date: April 4, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: An-Hsuan Lee, Chen-Hao Wu, Chun-Hung Liao, Huang-Lin Chao
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Patent number: 11942373Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin, a second fin and a third fin therebetween. A first insulating structure includes a first insulating layer formed between the first and third fins, a capping structure covering the first insulating layer, a first insulating liner covering sidewall surfaces of the first insulating layer and the capping structure and a bottom surface of the first insulating layer, and a second insulating liner formed between the first insulating liner and the first fin and between the first insulating liner and the third fin. The second insulating structure includes a second insulating layer formed between the second fin and the third fin and a third insulating liner formed between the second insulating layer and the second fin and between the second insulating layer and the third fin.Type: GrantFiled: May 10, 2023Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chu-An Lee, Chen-Hao Wu, Peng-Chung Jangjian, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao
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Publication number: 20240096818Abstract: Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.Type: ApplicationFiled: April 20, 2023Publication date: March 21, 2024Inventors: Harry-Hak-Lay Chuang, Yuan-Jen Lee, Kuo-An Liu, Ching-Huang Wang, C.T. Kuo, Tien-Wei Chiang
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Publication number: 20240084017Abstract: Monoclonal antibodies against human Mac-1 are provided. These antibodies can bind to different states of Mac-1 so as to alter the biofunctions of Mac-1. These antibodies can modulate Th1/Th2 cytokine secretions by TLR-activated immune cells and can be used for the treatments of diseases related to acute and chronic inflammatory disorders, such as infectious diseases, and cancers.Type: ApplicationFiled: December 30, 2021Publication date: March 14, 2024Applicant: Ascendo Biotechnology, Inc.Inventors: Yen-Ta Lu, Chia-Ming Chang, Ping-Yen Huang, I-Fang Tsai, Frank Wen-Chi Lee
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Patent number: 11927604Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.Type: GrantFiled: May 6, 2021Date of Patent: March 12, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Xinkun Huang, Dok Won Lee, Christopher Michael Ledbetter, Bret Alan Dahl, Roy Deidrick Solomon
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Patent number: 11918882Abstract: An interactive exercise apparatus for guiding a user to perform an exercise includes a display device and a detecting device. The display device is configured to display video imagery which shows an instructor image and at least one motion check image. The motion check image corresponds to a predetermined one of a plurality of body parts of the user, which has a motion guide track and a motion achievement evaluation. The detecting device is configured to detect displacement of the body parts. The motion guide track is displayed on a predetermined position of the video imagery with a predetermined track pattern, corresponding to a movement path of the predetermined body part when the user follows movements demonstrated by the instructor image to perform the exercise. The motion achievement evaluation indicates a matching degree determined according to the displacement of the predetermined body part detected by the detecting device.Type: GrantFiled: August 5, 2021Date of Patent: March 5, 2024Assignee: Johnson Health Tech Co., Ltd.Inventors: Hsin-Huang Chiang, Yu-Chieh Lee, Ning Chuang, Wei-Ting Weng, Cheng-Ho Yeh
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Publication number: 20230367680Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. In response to determining at least a portion of a first memory block passed a program verify operation associated with a last programming level of the set of programming levels, the control logic executes a first program sub-operation to terminate the programming operation with respect to a first subset of one or more memory planes of the set of memory planes that passed the program verify operation associated with the last programming level and identify a second subset of one or more memory planes that failed the program verify operation associated with the last programming level. The control logic executes a second program sub-operation to apply a trim set to the second subset of one or more memory planes that failed the program verify operation of the last programming level.Type: ApplicationFiled: May 5, 2023Publication date: November 16, 2023Inventors: Lu Tong, Ashish Ghai, Chai Chuan Yao, Ekamdeep Singh, Lakshmi Kalpana Vakati, Sheng Huang Lee, Matthew Ivan Warren, Dheeraj Srinivasan, Jeffrey Ming-Hung Tsai
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Publication number: 20230111510Abstract: Disclosed in some examples are methods, systems, devices, memory devices, and machine-readable mediums for using a non-defective portion of a block of memory on which there is a defect on a different portion. Rather than disable the entire block, the system may disable only a portion of the block (e.g., a first deck of the block) and salvage a different portion of the block (e.g., a second deck of the block).Type: ApplicationFiled: December 6, 2022Publication date: April 13, 2023Inventors: Sri Rama Namala, Lu Tong, Kristopher Kopel, Sheng-Huang Lee, Chang H. Siau
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Patent number: 11537484Abstract: Disclosed in some examples are methods, systems, devices, memory devices, and machine-readable mediums for using a non-defective portion of a block of memory on which there is a defect on a different portion. Rather than disable the entire block, the system may disable only a portion of the block (e.g., a first deck of the block) and salvage a different portion of the block (e.g., a second deck of the block).Type: GrantFiled: August 6, 2021Date of Patent: December 27, 2022Assignee: Micron Technology, Inc.Inventors: Sri Rama Namala, Lu Tong, Kristopher Kopel, Sheng-Huang Lee, Chang H. Siau
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Patent number: 11503734Abstract: An expansion card holder assembly that accepts different size expansion cards is disclosed. The expansion card holder assembly includes a metal base with grooves that roller features of a metal slide bracket fit into. The metal slide bracket is positioned along the metal base for different size expansion cards. The metal slide bracket is connected with a metal cover that is opened to accept expansions cards. A connector is provided for the expansion card to connect with printed circuit board.Type: GrantFiled: February 25, 2021Date of Patent: November 15, 2022Assignee: Dell Products L.P.Inventors: Chih Huang Lee, Chi-Ming Sun, Yu Ming Kuo
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Patent number: 11482298Abstract: A method of operating a memory device comprises generating a target voltage using a pump circuit of the memory device, the target voltage to be applied to a word line or pillar of a memory cell of the memory device; providing an indication of current generated by the pump circuit after the pump circuit output reaches the target voltage; and determining when the current generated by the pump circuit is greater than a specified threshold current and generating a fault indication according to the determination.Type: GrantFiled: May 29, 2020Date of Patent: October 25, 2022Assignee: Micron Technology, Inc.Inventors: Jason Lee Nevill, Preston Allen Thomson, Chi Ming Chu, Sheng-Huang Lee
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Patent number: 11456043Abstract: A processing device in a memory system receives a request to erase a data block of a memory device, determines a number of program/erase cycles performed on the data block, and performs an erase operation to erase the data block. The processing device further determines that the number of program/erase cycles performed on the data block satisfies a scan threshold condition and performs a first threshold voltage integrity scan on the data block to determine a first error rate associated with a current threshold voltage of at least one select gate device of the data block. Responsive to the first error rate associated with the current threshold voltage of the at least one select gate device satisfying an error threshold criterion, the processing device performs a touch up operation on the at least one select gate device to adjust the current threshold voltage to the target threshold voltage.Type: GrantFiled: April 13, 2021Date of Patent: September 27, 2022Assignee: Micron Technology, Inc.Inventors: Devin M. Batutis, Avinash Rajagiri, Sheng-Huang Lee, Chun Sum Yeung, Harish R. Singidi
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Patent number: 11451092Abstract: An assembly line includes a conveyor belt and an energy charging system. The energy charging system includes (i) a resonator having a TX resonator disposed along the conveyor belt and a RX resonator mounted on and transported by the conveyor belt, (ii) an impedance matching network in communication with the resonator, (iii) and an energy storage device in communication with at least one of the resonator and the impedance matching network. Vmin is a minimum voltage of the energy storage device, and Vcap is a voltage across the energy storage device measured in real time. Energy is transferred from the TX resonator to the RX resonator when the Vcap is less than Vmin of the energy storage device.Type: GrantFiled: August 29, 2018Date of Patent: September 20, 2022Assignee: Robert Bosch GmbHInventors: Xingyi Shi, Huang Lee, Vivek Jain
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Publication number: 20220272858Abstract: An expansion card holder assembly that accepts different size expansion cards is disclosed. The expansion card holder assembly includes a metal base with grooves that roller features of a metal slide bracket fit into. The metal slide bracket is positioned along the metal base for different size expansion cards. The metal slide bracket is connected with a metal cover that is opened to accept expansions cards. A connector is provided for the expansion card to connect with printed circuit board.Type: ApplicationFiled: February 25, 2021Publication date: August 25, 2022Applicant: Dell Products L.P.Inventors: Chih Huang Lee, Chi-Ming Sun, Yu Ming Kuo