Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

Abstract: The present disclosure provides a matrix device and an operation method thereof. The matrix device includes a transpose circuit and a memory. The transpose circuit is configured to receive a first element string representing a native matrix from a matrix source, wherein all elements in the native matrix are arranged in the first element string in one of a “row-major manner” and a “column-major manner”. The transpose circuit transposes the first element string into a second element string, wherein the second element string is equivalent to an element string in which all elements of the native matrix are arranged in another one of the “row-major manner” and the “column-major manner”. The memory is coupled to the transpose circuit to receive the second element string.

Abstract: A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.

Abstract: A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.

Abstract: A hairdye comb has a bottle-shaped handle having a neck, a connection disk, a comb strip, a tube passing through the connection disk, a hollow seat connected to the comb strip, a plurality of teeth disposed on the comb strip, and a plurality of slots formed on the comb strip. The connection disk has a valve diaphragm and a through hole. The pipe has an inner flange. The ball is inserted in the pipe. The hose is connected to the pipe and the tube. The connection disk is inserted in the neck of the bottle-shaped handle. The neck of the bottle-shaped handle is inserted in the hollow seat.

Abstract: An apparatus and a method for hermetically sealing a vacuum process chamber substantially without frictional force are provided. In the apparatus, a ball bearing is used between a door and a loader stage for facilitating the mounting of the former to the latter. A photosensing element is used which consists of a traversing flag mounted on a loader stage onto which a door is mounted, and a stationary photo transmitter/receiver mounted on the structure onto which a furnace tube is installed. The photosensing device enables the determination of the state of engagement between the door on the cantilever loader assembly and the flange on the furnace tube without any mechanical contact or frictional force occurring in the sensing device. A poorly mated interface between the door and the flange can thus be avoided and a substantially more reliable seal can be achieved between the sealing members.