Patents by Inventor Huang Yucai

Huang Yucai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and semiconductor package using the same
    Patent number: 8766100
    Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: July 1, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Qiu Yuan, Du Maohua, Huang Yucai, Gu Liqun
  • PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20120224335
    Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.
    Type: Application
    Filed: January 13, 2012
    Publication date: September 6, 2012
    Inventors: QIU YUAN, Du Maohua, Huang Yucai, Gu Liqun