Patents by Inventor Huaping PENG

Huaping PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11105984
    Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: August 31, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Peng Chen, Chong Heng, Huaping Peng, Shamei Shi, William H. Wang, Feng Xu, Ranran Zhang, Naizhi Zhao, Long Van Nguyen
  • Publication number: 20210109297
    Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Inventors: Peng Chen, Chong Heng, Huaping Peng, Shamei Shi, William H. Wang, Feng Xu, Ranran Zhang, Naizhi Zhao, Long Van Nguyen
  • Patent number: 10784602
    Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: September 22, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Jia Lian, Huaping Peng, Shamei Shi, William H Wang, Frank Flens, Henricus Jozef Vergeest
  • Patent number: 10641977
    Abstract: An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: May 5, 2020
    Assignee: Finisar Corporation
    Inventors: William H. Wang, Huaping Peng, Ranran Zhang, Yandong Mao, Shamei Shi
  • Publication number: 20200059022
    Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
    Type: Application
    Filed: February 26, 2019
    Publication date: February 20, 2020
    Inventors: Jia Lian, Huaping Peng, Shamei Shi, William H. Wang, Frank Flens, Henricus Jozef Vergeest
  • Patent number: 10466427
    Abstract: In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: November 5, 2019
    Assignee: Finisar Corporation
    Inventors: William H. Wang, Shamei Shi, Huaping Peng, Ranran Zhang, Haijun An
  • Publication number: 20190317283
    Abstract: An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.
    Type: Application
    Filed: April 12, 2019
    Publication date: October 17, 2019
    Inventors: William H. Wang, Huaping Peng, Ranran Zhang, Yandong Mao, Shamei Shi
  • Publication number: 20190067849
    Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
    Type: Application
    Filed: August 28, 2017
    Publication date: February 28, 2019
    Inventors: Jia Lian, Huaping Peng, Shamei Shi, William H Wang, Frank Flens, Henricus Jozef Vergeest
  • Patent number: 10218098
    Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 26, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Jia Lian, Huaping Peng, Shamei Shi, William H Wang, Frank Flens, Henricus Jozef Vergeest
  • Publication number: 20180267263
    Abstract: In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 20, 2018
    Inventors: William H. WANG, Shamei SHI, Huaping PENG, Ranran ZHANG, Haijun AN