Abstract: Disclosed are a method for filling at least one hole formed in a printed circuit board, a printed circuit board filled in such a manner, and a vehicle having such a printed circuit board. The method of filling at least one hole formed in a printed circuit board comprises: introducing a paste comprising an electrically conductive metal powder and an electrolyte into the at least one hole of the printed circuit board, S1; and galvanic metallization of the printed circuit board so that elemental metal is deposited from the electrolyte in the at least one hole during the galvanic metallisation, S2.

Abstract: A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.

Abstract: A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.

Abstract: Filling assembly for filling holes formed in a plate, such as a printed circuit board, with a filing material, comprising a support device for supporting the plate, a filling device having a filling material source and a feeding channel connected to the filling material source for feeding filling material from the filling material source to the plate supported by the support device, wherein the feeding channel leads to an output opening held adjoining the plate for filling the filling material into the respective hole of the supported plate, and a vibration device connected to a side wall of the feeding channel, by which the side wall can be vibrated at a particular frequency transverse to the feeding channel, such that the feeding channel is correspondingly diminished at least adjacent to its output opening periodically.

Abstract: Filling assembly for filling holes formed in a plate, such as a printed circuit board, with a filing material, comprising a support device for supporting the plate, a filling device having a filling material source and a feeding channel connected to the filling material source for feeding filling material from the filling material source to the plate supported by the support device, wherein the feeding channel leads to an output opening held adjoining the plate for filling the filling material into the respective hole of the supported plate, and a vibration device connected to a side wall of the feeding channel, by which the side wall can be vibrated at a particular frequency transverse to the feeding channel, such that the feeding channel is correspondingly diminished at least adjacent to its output opening periodically.

Abstract: Method of coating a board and a board coating system for performing the method. The inventive method is intended for coating a board with liquid coating material, particularly for coating a basis plate intended for circuit boards with liquid photoresist. Here, the plate which is to be coated is transported by a transport apparatus past a coating roller while in contact with the latter. The coating roller is rotated in a vertical orientation and, during coating, the board is held by the transport apparatus on its upper edge in a vertically hanging position and is led past the vertically oriented coating roller by the transport apparatus.

Abstract: Method of coating a board and a board coating system for performing the method. The inventive method is intended for coating a board with liquid coating material, particularly for coating a basis plate intended for circuit boards with liquid photoresist. Here, the plate which is to be coated is transported by a transport apparatus past a coating roller while in contact with the latter. The coating roller is rotated in a vertical orientation and, during coating, the board is held by the transport apparatus on its upper edge in a vertically hanging position and is led past the vertically oriented coating roller by the transport apparatus.