Patents by Inventor Hucheng Lee
Hucheng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11783470Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: GrantFiled: April 18, 2022Date of Patent: October 10, 2023Assignee: KLA CORPORATIONInventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 11619592Abstract: Methods and systems for selecting defect detection methods for inspection of a specimen are provided. One system includes one or more computer subsystems configured for separating polygons in a care area into initial sub-groups based on a characteristic of the polygons on the specimen and determining a characteristic of noise in output generated by a detector of an inspection subsystem for the polygons in the different initial sub-groups. The computer subsystem(s) are also configured for determining final sub-groups for the polygons by combining any two or more of the different initial sub-groups having substantially the same values of the characteristic of the noise. In addition, the computer subsystem(s) are configured for selecting first and second defect detection methods for application to the output generated by the detector of the inspection subsystem during inspection of the specimen or another specimen.Type: GrantFiled: June 23, 2020Date of Patent: April 4, 2023Assignee: KLA Corp.Inventors: Bjorn Brauer, Hucheng Lee, Sangbong Park
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Patent number: 11615993Abstract: A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.Type: GrantFiled: November 9, 2020Date of Patent: March 28, 2023Assignee: KLA CORPORATIONInventors: Boshi Huang, Hucheng Lee, Vladimir Tumakov, Sangbong Park, Bjorn Brauer, Erfan Soltanmohammadi
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Publication number: 20220405903Abstract: Wafer-to-wafer and within-wafer image contrast variations can be identified and mitigated by extracting an image frame during recipe setup and then during runtime at the same location. Image contrast is determined for the two image frames. A ratio of the contrast for the two image frames can be used to determine contrast variations and focus variation.Type: ApplicationFiled: September 2, 2021Publication date: December 22, 2022Inventors: Bjorn Brauer, Sangbong Park, Hucheng Lee
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Patent number: 11416982Abstract: Methods and systems for controlling a process for inspection of a specimen are provided. One system includes one or more computer subsystems configured for determining a statistical characteristic of difference images generated for multiple instances of a care area on a specimen and determining variation in the statistical characteristic compared to a statistical characteristic of difference images generated for multiple instances of the care area on one or more other specimens. In addition, the one or more computer subsystems are configured for determining one or more changes to one or more parameters used for detecting defects in the care area on the specimen based on the variation.Type: GrantFiled: September 23, 2020Date of Patent: August 16, 2022Assignee: KLA Corp.Inventors: Bjorn Brauer, Hucheng Lee, Sangbong Park
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Publication number: 20220245791Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: ApplicationFiled: April 18, 2022Publication date: August 4, 2022Inventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 11308606Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: GrantFiled: August 16, 2019Date of Patent: April 19, 2022Assignee: KLA CORPORATIONInventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 11244442Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.Type: GrantFiled: July 11, 2019Date of Patent: February 8, 2022Assignee: KLA CorporationInventors: Hucheng Lee, Lisheng Gao, Jan Lauber, Yong Zhang
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Patent number: 11049745Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.Type: GrantFiled: May 21, 2019Date of Patent: June 29, 2021Assignee: KLA CorporationInventors: David Dowling, Tarunark Singh, Bjorn Brauer, Santosh Bhattacharyya, Bryant Mantiply, Hucheng Lee, Xiaochun Li, Sangbong Park
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Publication number: 20210159127Abstract: A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.Type: ApplicationFiled: November 9, 2020Publication date: May 27, 2021Inventors: Boshi Huang, Hucheng Lee, Vladimir Tumakov, Sangbong Park, Bjorn Brauer, Erfan Soltanmohammadi
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Patent number: 11010885Abstract: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.Type: GrantFiled: May 8, 2019Date of Patent: May 18, 2021Assignee: KLA CorporationInventors: Bjorn Brauer, Richard Wallingford, Kedar Grama, Hucheng Lee, Sangbong Park
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Publication number: 20210097666Abstract: Methods and systems for controlling a process for inspection of a specimen are provided. One system includes one or more computer subsystems configured for determining a statistical characteristic of difference images generated for multiple instances of a care area on a specimen and determining variation in the statistical characteristic compared to a statistical characteristic of difference images generated for multiple instances of the care area on one or more other specimens. In addition, the one or more computer subsystems are configured for determining one or more changes to one or more parameters used for detecting defects in the care area on the specimen based on the variation.Type: ApplicationFiled: September 23, 2020Publication date: April 1, 2021Inventors: Bjorn Brauer, Hucheng Lee, Sangbong Park
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Publication number: 20210049755Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.Type: ApplicationFiled: August 16, 2019Publication date: February 18, 2021Inventors: Junqing Huang, Hucheng Lee, Sangbong Park, Xiaochun Li
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Patent number: 10923317Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.Type: GrantFiled: August 18, 2019Date of Patent: February 16, 2021Assignee: KLA Corp.Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
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Publication number: 20210010945Abstract: Methods and systems for selecting defect detection methods for inspection of a specimen are provided. One system includes one or more computer subsystems configured for separating polygons in a care area into initial sub-groups based on a characteristic of the polygons on the specimen and determining a characteristic of noise in output generated by a detector of an inspection subsystem for the polygons in the different initial sub-groups. The computer subsystem(s) are also configured for determining final sub-groups for the polygons by combining any two or more of the different initial sub-groups having substantially the same values of the characteristic of the noise. In addition, the computer subsystem(s) are configured for selecting first and second defect detection methods for application to the output generated by the detector of the inspection subsystem during inspection of the specimen or another specimen.Type: ApplicationFiled: June 23, 2020Publication date: January 14, 2021Inventors: Bjorn Brauer, Hucheng Lee, Sangbong Park
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Publication number: 20200193588Abstract: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.Type: ApplicationFiled: May 8, 2019Publication date: June 18, 2020Inventors: Bjorn Brauer, Richard Wallingford, Kedar Grama, Hucheng Lee, Sangbong Park
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Publication number: 20200126830Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.Type: ApplicationFiled: May 21, 2019Publication date: April 23, 2020Inventors: David Dowling, Tarunark Singh, Bjorn Brauer, Santosh Bhattacharyya, Bryant Mantiply, Hucheng Lee, Xiaochun Li, Sangbong Park
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Patent number: 10599944Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.Type: GrantFiled: November 27, 2012Date of Patent: March 24, 2020Assignee: KLA-Tencor CorporationInventors: Hucheng Lee, Junqing Huang, Lisheng Gao
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Publication number: 20200090904Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.Type: ApplicationFiled: August 18, 2019Publication date: March 19, 2020Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
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Patent number: 10557802Abstract: Repeater analysis at a first threshold identifies repeater defects. The repeater defects are located at a coordinate that is the same on each reticle. Images on every reticle of the semiconductor wafer at the coordinate are received, and a plurality of signed difference images are obtained. A repeater threshold for signed difference images is calculated, as is consistency of the polarity. The threshold is applied to the images and a number of defects per each repeater that remain are determined. A secondary repeater threshold can be applied for nuisance filtering.Type: GrantFiled: August 13, 2018Date of Patent: February 11, 2020Assignee: KLA-Tencor CorporationInventors: Bjorn Brauer, Hucheng Lee