Abstract: A method and apparatus for controlling wafer preparation are provided. The method includes that: in response to first work-in-process preparation dispatching instruction, the number of first available devices corresponding to preparation process of first work-in-process at a current site is acquired from wafer preparation information base and based on real-time dispatching system for wafer preparation, and a maximum loading capacity of first available devices is acquired, wafer preparation information base including the number of available devices and the maximum loading capacity of available devices corresponding to preparation process of multiple work-in-process at the current site; when the number of first available devices is greater than or equal to preset number of available devices, and the maximum loading capacity of first available devices is greater than or equal to preset maximum loading capacity, a preparation instruction of first work-in-process is issued based on real-time dispatching system.

Abstract: A transport system having multilayer tracks is presented. The system has a bottom track and at least one top track disposed above on the bottom track. Shuttle carriages are moving along the top and bottom tracks. The shuttle body of each shuttle carriage has a first locking portion on the top end thereof, and has a second locking portion on the bottom end thereof. The second locking portion of the shuttle carriage on the top track can be locked with the first locking portion of the shuttle carriage on the bottom track. Therefore, the two transports on different tracks are locked so that the object can be transported between the top and bottom tracks.

Abstract: A transport system having multilayer tracks is presented. The system has a bottom track and at least one top track disposed above on the bottom track. Shuttle carriages are moving along the top and bottom tracks. The shuttle body of each shuttle carriage has a first locking portion on the top end thereof, and has a second locking portion on the bottom end thereof. The second locking portion of the shuttle carriage on the top track can be locked with the first locking portion of the shuttle carriage on the bottom track. Therefore, the two transports on different tracks are locked so that the object can be transported between the top and bottom tracks.