Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Abstract: A sole structure with complex waterproof and gas-permeable material and a manufacturing method thereof. A plane blank having a through with a pattern of an array is provided. At least one waterproof and gas-permeable film is combined with the plane blank to cover the through hole. The plane blank with the film is located in a predetermined position inside a sole mold. Then a molten plastic material is filled into the mold to associate the plane blank and the film with the plastic material to form an integral large substrate of the sole. The sole provides waterproof and gas-permeable effect to prevent water from tarrying between the large substrate and middle substrate.