Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: A method of forming a semiconductor device is provided. The method includes placing a semiconductor die and a leadframe on a carrier substrate. The semiconductor die includes a plurality of bond pads and the leadframe includes a plurality of leads. A first lead of the plurality of leads has a proximal end affixed to a first bond pad of the plurality of bond pads and a distal end placed on the carrier substrate. At least a portion of the semiconductor die and the leadframe is encapsulated with an encapsulant. The carrier substrate is separated from a first major side of the encapsulated semiconductor die and leadframe exposing a distal end portion of the first lead. A package substrate is applied on the first major side.

Abstract: A heat transfer device for integrating with a backlight unit for an edge-lit motor vehicle display apparatus includes an anterior capillary tube operable to integrate with a rear side of the backlight unit, the anterior capillary tube further operable to dissipate heat from an anterior of a backlight unit of a motor vehicle display. The heat transfer device further includes a posterior capillary tube operable to be positioned away from the backlight unit, the posterior capillary tube further operable to dissipate heat from a posterior of a backlight unit of a motor vehicle display. The heat transfer device further comprises a phase changing medium operable to fluidly transfer between the first capillary tube and the second pillar tube during a heat transfer process, where the phase changing medium is operable to phase change between a gaseous state and a liquid state during the heat transfer process.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes depositing a non-conductive layer over a semiconductor die. An opening is formed in the non-conductive layer exposing a portion of a bond pad of the semiconductor die. A cavity is in the non-conductive layer with a portion of the non-conductive layer remaining between a bottom surface of the cavity and a bottom surface of the non-conductive layer. A conductive layer is formed over the non-conductive layer and the portion of the bond pad. The conductive layer is configured to interconnect the bond pad with a conductive layer portion over the cavity.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes depositing a non-conductive layer over a semiconductor die. An opening is formed in the non-conductive layer exposing a portion of a bond pad of the semiconductor die. A cavity is in the non-conductive layer with a portion of the non-conductive layer remaining between a bottom surface of the cavity and a bottom surface of the non-conductive layer. A conductive layer is formed over the non-conductive layer and the portion of the bond pad. The conductive layer is configured to interconnect the bond pad with a conductive layer portion over the cavity.

Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.

Abstract: The invention relates to the use of a CD28-specific superagonistic monoclonal antibody (MAB) or of a mimetic compound of the same, for producing a pharmaceutical composition, wherein the dosage is below or above a defined dosage limit.

Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.

Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.

Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.

Abstract: A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.

Abstract: A design application allows one or more authors to create a learning path associated with a given topic. The learning path includes content curated from various online resources. The design application allows the authors to aggregate the content from the various online resources. The design application allows the author to curate content to include or associate with nodes. The design application also allows the authors to arrange the nodes in a hierarchy. When the learning path is complete, the design application presents the learning path to users. Users access the content within the learning path according to the hierarchy of the nodes. Advantageously, the author is able to present content, which may otherwise be distributed across the internet, within a cohesive learning path.

Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.

Abstract: The invention relates to a method for fabricating piezoelectric composite material comprising steps of mixing a piezoelectric ceramic powder, an adhesive, a cross-linking agent, a lubricant and a plasticizer to form a slurry; extruding the slurry to form a piezoelectric ceramic green fiber; sintering the piezoelectric ceramic green fiber to form the piezoelectric ceramic fiber; arranging the piezoelectric ceramic fiber in a mold according to a predetermined volumetric content; and adding a polymer into the mode to form a polymer matrix of piezoelectric composite material. A piezoelectric power generating device including a piezoelectric power generating element made of the piezoelectric composite material is also provided.

Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.

Abstract: The method of preparing novel allyl ethers. Novel glycidyl ethers and their preparation. Polyfunctional poly(glycidyl ethers) their methods of preparation. Novel polyurethanes based on the polyfunctional glycidyl ethers and their method of preparation.

Abstract: The invention relates to the use of a CD28-specific superagonistic monoclonal antibody (MAB) or of a mimetic compound of the same, for producing a pharmaceutical composition, wherein the dosage is below or above a defined dosage limit.

Abstract: 3-nitratooxetane. Poly-(3-nitratooxetane). The method of synthesizing 3-nitratooxetane comprising reacting 3-hydroxyoxetane with a nitration agent. The method of synthesizing poly-(3-nitratooxetane) by polymerizing 3-nitratooxetane using a polyol initiator.