Patents by Inventor Huey-Ru Chang
Huey-Ru Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10129974Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones.Type: GrantFiled: August 24, 2016Date of Patent: November 13, 2018Assignees: Industrial Technology Research Institute, First Hi-tec Enterprise Co., Ltd., NEXCOM International Co., Ltd.Inventors: Chien-Min Hsu, Min-Lin Lee, Huey-Ru Chang, Hung-I Liu, Ching-shan Chang
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Publication number: 20170273174Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones.Type: ApplicationFiled: August 24, 2016Publication date: September 21, 2017Applicants: Industrial Technology Research Institute, First Hi-tec Enterprise Co.,Ltd., NEXCOM International Co., Ltd.Inventors: Chien-Min Hsu, Min-Lin Lee, Huey-Ru Chang, Hung-I Liu, Ching-shan Chang
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Patent number: 8525328Abstract: The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.Type: GrantFiled: July 14, 2011Date of Patent: September 3, 2013Assignee: Industrial Technology Research InstituteInventors: Jiin-Shing Perng, Min-Lin Lee, Shinn-Juh Lai, Huey-Ru Chang
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Patent number: 8237520Abstract: A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.Type: GrantFiled: February 27, 2009Date of Patent: August 7, 2012Assignee: Industrial Technology Research InstituteInventors: Huey-Ru Chang, Min-Lin Lee, Jiin-Shing Perng, Sheng-Che Hung, Shinn-Juh Lai
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Publication number: 20120168839Abstract: The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.Type: ApplicationFiled: July 14, 2011Publication date: July 5, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiin-Shing Perng, Min-Lin Lee, Shinn-Juh Lai, Huey-Ru Chang
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Patent number: 8198538Abstract: A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.Type: GrantFiled: February 25, 2009Date of Patent: June 12, 2012Assignee: Industrial Technology Research InstituteInventors: Chien-Min Hsu, Min-Lin Lee, Shinn-Juh Lai, Huey-Ru Chang, Ray-Fong Hong
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Patent number: 7875808Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.Type: GrantFiled: September 13, 2006Date of Patent: January 25, 2011Assignee: Industrial Technology Research InstituteInventors: Huey-Ru Chang, Min-Lin Lee, Shinn-Juh Lay, Chin Sun Shyu
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Publication number: 20090267704Abstract: A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.Type: ApplicationFiled: February 27, 2009Publication date: October 29, 2009Inventors: Huey-Ru CHANG, Min-Lin Lee, Jiin-Shing Perng, Sheng-Che Hung, Shinn-Juh Lai
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Publication number: 20090219668Abstract: A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.Type: ApplicationFiled: February 25, 2009Publication date: September 3, 2009Inventors: Chien-Min Hsu, Min-Lin Lee, Shinn-Juh Lai, Huey-Ru Chang, Ray-Fong Hong
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Publication number: 20070062726Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.Type: ApplicationFiled: September 13, 2006Publication date: March 22, 2007Applicant: Industrial Technology Research InstituteInventors: Huey-Ru Chang, Min-Lin Lee, Shinn-Juh Lay, Chin Sun Shyu
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Patent number: 7064427Abstract: A unitary buried array capacitor and microelectronic structures incorporating such capacitors are disclosed. A unitary buried array capacitor can be formed by a top layer of electrode, a middle layer of dielectric, and a bottom layer of electrode. A first electrode lead, a second electrode lead and at least one interconnect line pass through the three layers while only the first electrode lead making electrical contact with the top layer of electrode and only the second electrode lead making electrical contact with the bottom electrode.Type: GrantFiled: June 7, 2004Date of Patent: June 20, 2006Assignee: Industrial Technology Research InstituteInventors: Stephen Chung, Jungle Lee, Shinn-Juh Lay, Randy Wu, Huey-Ru Chang, Yu-Mei Cheng
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Publication number: 20050269685Abstract: A unitary buried array capacitor and microelectronic structures incorporating such capacitors are disclosed. A unitary buried array capacitor can be formed by a top layer of electrode, a middle layer of dielectric, and a bottom layer of electrode. A first electrode lead, a second electrode lead and at least one interconnect line pass through the three layers while only the first electrode lead making electrical contact with the top layer of electrode and only the second electrode lead making electrical contact with the bottom electrode.Type: ApplicationFiled: June 7, 2004Publication date: December 8, 2005Inventors: Stephen Chung, Jungle Lee, Shinn-Juh Lay, Randy Wu, Huey-Ru Chang, Yu-Mei Cheng
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Publication number: 20040149490Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.Type: ApplicationFiled: January 23, 2004Publication date: August 5, 2004Inventors: Huey-Ru Chang, Min-Lin Lee, Ted C. Ho
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Patent number: 6717071Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.Type: GrantFiled: March 16, 2001Date of Patent: April 6, 2004Assignee: Industrial Technology Research InstituteInventors: Huey-Ru Chang, Min-Lin Lee, Ted C. Ho
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Patent number: 6683781Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.Type: GrantFiled: May 23, 2002Date of Patent: January 27, 2004Assignee: Industrial Technology Research InstituteInventors: Ted C. Ho, Min-Lin Lee, Huey-Ru Chang, Shinn-Juh Lay
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Publication number: 20030217858Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.Type: ApplicationFiled: May 23, 2002Publication date: November 27, 2003Inventors: Ted C. Ho, Min-Lin Lee, Huey-Ru Chang, Shinn-Juh Lay
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Publication number: 20020047772Abstract: An electrical-resistant via hole structure used in a carrier is disclosed. The electrical-resistant via hole includes a via hole and electrical-resistant material. The via hole is in the carrier and extends along a first direction. The electrical-resistant material is placed into the via hole and contacts with first and second conductors. The assembly consisting of a first conductor, electrical-resistant material, and second conductor composes a resistor. The electrical-resistant via hole of the invention needs less area and reduces the size of PCBs.Type: ApplicationFiled: July 23, 2001Publication date: April 25, 2002Inventors: Huey-Ru Chang, Min-Lin Lee, Ted C. Ho
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Publication number: 20020017399Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.Type: ApplicationFiled: March 16, 2001Publication date: February 14, 2002Inventors: Huey-Ru Chang, Min-Lin Lee, Ted C. Ho