Patents by Inventor Hugh Michael McMahon

Hugh Michael McMahon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BIOACTIVE GLASS COMPOSITIONS
    Publication number: 20240140854
    Abstract: A silicate-based glass composition includes 15-65 wt. % SiO2, 2.5-25 wt. % MgO, 1-30 wt. % P2O5, and 15-50 wt. % CaO, such that the composition has a hydrolytic resistance of glass grains (HGB) of at most 3, when measured by International Organization for Standardization section 719 (ISO 719) and forms a bioactive crystalline phase in a simulated body fluid.
    Type: Application
    Filed: March 1, 2022
    Publication date: May 2, 2024
    Inventors: Qiang Fu, Aize Li, Hugh Michael McMahon
  • Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same
    Patent number: 11527452
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: December 13, 2022
    Assignee: CORNING INCORPORATED
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun-Ro Yoon
  • Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
    Publication number: 20220278005
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Application
    Filed: May 13, 2022
    Publication date: September 1, 2022
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun-Ro Yoon
  • Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same
    Patent number: 11367665
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: June 21, 2022
    Assignee: CORNING INCORPORATED
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun Ro Yoon
  • Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
    Publication number: 20200235020
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Application
    Filed: July 24, 2018
    Publication date: July 23, 2020
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun Ro Yoon