Abstract: Conventional packaging of optical sensors is of little assistance in determining the location and attitude of the focal place of the sensor 10, since package tolerances lack the requisite precision. Each sensor 10 must be separately focused to its optical assembly 40. Such focusing is expensive, as is the package itself. This invention instead mounts the sensor 10 directly onto one face 28 of a transparent plate 18. Radiation is focused through the plate 18 and onto the sensor 10. Precision alignment targets 12, 22 are formed separately on the sensor 10 (providing a known location of the active image area 14 with respect to the target 12) and on the plate 18 (providing a known location of the edges 24 of the plate 18 with respect to the target 22). The targets 12, 22 are aligned, and contact pads 16, 30 on the sensor 10 and on the plate 18 are joined by electronically conductive bumps 36 of known thickness. The plate 18 itself is of known thickness.

Abstract: High voltage switches distribute ignition voltages to spark plugs of an internal combustion engine. A high-voltage switch uses an array of high voltage semiconductor transistors mounted on a single insulated substrate. The high voltage array requires only a single transistor working with a single photo-diode to trigger the array. A light source is mounted in the center of a distributor cap and light from the light source is directed into a light directing rotor. The light directing rotor is designed to reflect light to the photo-diode trigger of each high voltage array. The control circuitry is operated with low voltage.

Abstract: This invention relates to an electro-optic modulator device, such as a multi-gate light valve for an electro-optic line printer, wherein the different elements are uniquely combined in a package utilizing VLSI principles. A specially designed integrated circuit package is utilized to enable the bonding of one or two electro-optical devices as a single unit. As each electro-optical device has its chip pads at one end of the device, special modifications need to be made to joint the pads to the external connectors. The electro-optical crystal, which may be mounted on a glass plate, is bonded to the integrated circuit chip. Sonic bonding or the two layer metal technique may be used for the crystal to chip bonding.