Abstract: The present invention provides a device for separating and purifying the collagen Type 2 in chicken bones, comprising a liquid fluid container, a raw liquid container, a membrane separation tank, a mixing tube, two high pressure metering motors, a precooler, two preheaters, a temperature controller, two one-way valves, two inlet control valves and two outlet control valves. The liquid extract of defatted chicken bones discharged from the raw liquid container and the liquid CO2 discharged from the liquid fluid container can be mixed uniformly in the mixing tube, and then fed into the membrane separation tank. The membrane separation tank produces small-molecular-weight peptides and large-molecular-weight collagen Type 2 harmlessly and efficiently.

Abstract: A method of making triterpenoids from petri dish cultured Antrodia cinnamomea includes: A. providing petri dish cultured Antrodia cinnamomea in an extracting container; B. providing a supercritical solvent to the extracting container to obtain an Antrodia cinnamomea extract; sending the Antrodia cinnamomea extract to a chromatographic column to separate impurities and triterpenoids from the Antrodia cinnamomea extract, and removing the impurities, and collecting the triterpenoids containing fraction; and C. testing the bioactivity of the triterpenoids containing fraction by cytotoxicity test, cell morphology analysis, cell cycle and apoptosis test, and cell motility test to find an anti-cancer effect of the triterpenoids.

Abstract: A packet switch device includes an input port, a loop-back port, a storage module, and a switch engine. The input port receives a packet. The storage module stores packet flow tables. Each packet flow table includes at least one flow entry and action. The switch engine compares the packet with a default packet flow table of the plurality of packet flow tables when it determines that the packet does not include a flow header. The switch engine includes the packet with the flow entry of the default packet flow table and performs the corresponding action when the packet matches the flow entry. When the action includes a specific action of comparing the packet with another one of the packet flow tables, the switch engine attaches the flow header to the packet to set a flow ID therein and transmits the packet back to the switch engine through the loop-back port.

Abstract: A method of making artepillin C in propolis includes the following steps: A. Mix propolis with ethanol to obtain a propolis-ethanol extract; B. Provide supercritical carbon dioxide and the propolis-ethanol extract to a chromatographic column to separate wax and artepillin C, and then remove the wax at a bottom of the chromatographic column and collect the artepillin C containing isolate at a top of the chromatographic column; and C. Test the artepillin C by a cytotoxicity test, a cell morphology analysis, a cell cycle and apoptosis test, and a cell motility metastasis test to find an anti-cancer effect of the artepillin C containing isolate.

Abstract: A packet switch device includes an input port, a loop-back port, a storage module, and a switch engine. The input port receives a packet. The storage module stores packet flow tables. Each packet flow table includes at least one flow entry and action. The switch engine compares the packet with a default packet flow table of the plurality of packet flow tables when it determines that the packet does not include a flow header. The switch engine includes the packet with the flow entry of the default packet flow table and performs the corresponding action when the packet matches the flow entry. When the action includes a specific action of comparing the packet with another one of the packet flow tables, the switch engine attaches the flow header to the packet to set a flow ID therein and transmits the packet back to the switch engine through the loop-back port.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: A method of fabricating micro mechanical moving member and metal interconnects thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed. After that, at least one micro mechanical moving member electrically connected to the second metal interconnect pattern is formed on the inter-metal dielectric layer by plating techniques.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.