Patents by Inventor Hui-Chuan Yao

Hui-Chuan Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069618
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
  • Publication number: 20090225491
    Abstract: A metallized film capacitor includes a capacitor unit having two insulating substrates superposed with each other each having an upper surface and a lower surface, four electrode layers applied onto the surfaces of the insulating substrates, and two of the electrode layers include an end terminal extended toward one end portion of the insulating substrates, and the other two electrode layers include an end terminal extended toward the other end portion of the insulating substrate for suitably increasing the capacitance of the capacitor unit without increasing the size or the volume of the metallized film capacitor and without complicating the structure of the metallized film capacitor.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 10, 2009
    Inventor: Hui-Chuan Yao