Patents by Inventor Hui Feng

Hui Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980216
    Abstract: The disclosure discloses stabilized rice aleurone and a preparation method, using the technology of classifying a rice aleurone layer by a tangential injection airflow impeller classifier combined with an ultrasonic vibrating screen for the first time, and simultaneously uses steam treatment coupled with thermal enzyme inactivation by drum drying as a stabilization method to prepare the stabilized rice aleurone for the first time. The drum drying equipment realizes the two purposes of enzyme inactivation and drying, and the method has the advantages of short process flow, simple equipment, high utilization rate, small floor space, low investment, low energy consumption and no pollution, and is suitable for industrial promotion. The stabilized rice aleurone has high nutritional value, is rich in functional ingredients, and can be used as a raw material for functional food development in industrial production and food applications.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: May 14, 2024
    Assignees: JIANGSU STATE FARM CEREALS INDUSTRY GROUP CO., LTD., JIANGNAN UNIVERSITY, JIANGSU PROVINCIAL AGRICULTURAL RECLAMATION AND DEVELOPMENT CO., LTD.
    Inventors: Li Wang, Hui Lu, Zhicun Xu, Zhengxing Chen, Zhaoqin Zong, Yongfu Li, Xiaoyu Feng, Jie Jiang, Congnan Zhang, Haifeng Xu, Ru Feng
  • Patent number: 11980454
    Abstract: A system for measurements and calculations of a microcirculatory high-velocity blood flow includes a data acquisition module configured to select and acquire microcirculatory blood vessel image data; a storage module configured to store the acquired microcirculatory blood vessel image data; a velocity measurement module configured to measure a traveling distance and a traveling time of red blood cell (RBC), white blood cell (WBC), or plasma particles in a blood vessel sample and calculate a ratio of the traveling distance to the traveling time to obtain a blood flow velocity; and a high-velocity blood flow index module configured to determine an index level for the microcirculatory high-velocity blood flow. Specifically, an initial threshold, i.e. 1000 ?m/s, for the microcirculatory high-velocity blood flow of sepsis is proposed, which facilitates early diagnosis on sepsis. The changing process of the high-velocity blood flow shows development of the early-stage, intermediate-stage and end-stage sepsis.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: May 14, 2024
    Assignee: XUZHOU LIHUA ELECTRONIC TECHNOLOGY DEVELOPMENT CO., LIMITED
    Inventors: Xinghuai Feng, Hui Feng, Jie Shao, Jing Lu, Yuanchang Zhang
  • Publication number: 20240155298
    Abstract: A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.
    Type: Application
    Filed: April 26, 2023
    Publication date: May 9, 2024
    Inventors: Tseng-Feng Wen, Hui Xue, Yangfang Chen
  • Patent number: 11978678
    Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
  • Publication number: 20240142512
    Abstract: A semiconductor device testing system, with a platform for supporting a semiconductor substrate, a light emitting system directed toward the platform, a controller, coupled to the light emitting system and adapted to selectively alter an operational parameter of the light emitting system, and a tester configured to characterize an electrical parameter of an electrical device formed in or over the semiconductor substrate while the electrical device is illuminated by one or more wavelengths of light emitted by the light emitting system under direction of the controller.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: Zhi Peng Feng, Ren Hui Fan, Alfred Griffin, He Lin
  • Publication number: 20240147143
    Abstract: An open-ear earphone includes a housing, a chamber is provided inside the housing, a speaker is provided inside the chamber and divides the chamber into a front chamber and a rear chamber. The housing is provided with a first sound hole and a second sound hole. The front chamber is communicated to the outside through the first sound hole, and the rear chamber is communicated to the outside through the second sound hole. The rear chamber includes a first volume down chamber and a second volume down chamber communicated to the first volume down chamber, and the first volume down chamber is located between the speaker and the second volume down chamber. The sound wave in backward motion generated by the speaker is transmitted to the outside from the second sound hole after being reduced by the first volume down chamber and the second volume down chamber.
    Type: Application
    Filed: January 31, 2023
    Publication date: May 2, 2024
    Applicant: UI (Wan An) Technology Co. Ltd
    Inventors: Jiaquan Yi, Xiaobin Shen, Shenfa Wan, Yafan Li, Yunfeng Wang, Zhaoquan Mai, Qian He, Hui He, Shaobing Lai, Zhuoqi Chen, Yong Wang, Jiabao Chen, Lei Bao, Nan Feng
  • Publication number: 20240147115
    Abstract: An open-ear Bluetooth® earphone includes an earphone body and a support frame. The support frame is configured to be plugged into a cavum concha of a wearer. The earphone body is provided with an audio source, and the support frame is installed on the earphone body and corresponds to the audio source. When in use, the support frame is configured to be firmly plugged into the cavum concha of the wearer to allow the earphone body to be worn on the ear of the wearer. The audio source corresponds to the ear canal of the wearer through the support frame, so that the sound emitted from the audio source is transmitted into the ear canal through the support frame. The audio source is directly opposite of the ear canal through the support frame to shorten the distance between the audio source and the ear canal.
    Type: Application
    Filed: July 12, 2023
    Publication date: May 2, 2024
    Applicant: UI (Wan An) Technology Co. Ltd
    Inventors: Zhaoquan MAI, Xiaobin SHEN, Yafan LI, Jiaquan YI, Yunfeng WANG, Qian HE, Hui HE, Shaobing LAI, Zhuoqi CHEN, Yong WANG, Jiabao CHEN, Lei BAO, Nan FENG
  • Patent number: 11971797
    Abstract: A digital mirroring method includes creating a digital model for each physical device of a plurality of physical devices located in a physical space. Once a related data of each physical device is obtained, the related data of each physical device is mapped to corresponding digital model.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 30, 2024
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin Lu, Fu-Fa Cai, Hui-Feng Liu
  • Publication number: 20240131952
    Abstract: This application provides a charging plug and socket-outlet, charging and to-be-charged apparatuses, a charging system, and a control method. The charging system includes: a charging apparatus and a to-be-charged apparatus. The charging apparatus includes a charging plug and a first cooling system. The charging plug includes a first electrical transmission interface, a first heat conduction output interface, and a first heat conduction input interface. The to-be-charged apparatus includes a battery, a charging socket-outlet, and a second cooling system. The charging socket-outlet includes a second electrical transmission interface, a second heat conduction output interface, and a second heat conduction input interface. The solutions of this application can be used to meet a heat dissipation requirement of the battery in the to-be-charged apparatus during super charging.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 25, 2024
    Inventors: Deyuan Wang, Hui Feng, Liwen Pan
  • Publication number: 20240126446
    Abstract: Described herein are systems, methods, and software to manage multi-type storage in a cluster computing environment. In one example, a host can identify health and performance information at a first time for each local data store on the host and a hyperconverged data store available to the host. The host can further identify health and performance information associated with the data stores at a second time and can compare the health and performance information at the first time and the second time to identify differences in the information. The host then communicates the differences to a second host in the computing environment.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Inventors: Yang Yang, Yu Wu, Jin Feng, Hui Xu, Zhuocheng Shen, Rajesh Venkatasubramanian
  • Publication number: 20240118741
    Abstract: A power source module for powering a motherboard comprises a rectifier circuit, a controlling unit, and a leakage protection circuit. The rectifier circuit electrically connected with the motherboard converts the input voltage into the first voltage configured for powering the motherboard. The controlling unit electrically connected with the motherboard outputs the control signals based on an operation state of the motherboard. The leakage protection circuit electrically connected with the controlling unit guides the control signals into a signal line before the motherboard being powered. The leakage protection circuit avoids the control signals to the component of the motherboard, and an operation time sequence of the component is not disturbed before being powered. A power distribution board and a server system are also disclosed.
    Type: Application
    Filed: April 6, 2023
    Publication date: April 11, 2024
    Inventors: HE FENG, YING LI, HUI-BO LIU
  • Publication number: 20240119128
    Abstract: A system includes a hardware processor, and a system memory storing a software code. The hardware processor executes the software code to receive, from a user, a request related to a digital asset, obtain, from the user, verification data for use in creating a record of ownership of the digital asset, create, using the verification data, the record of ownership of the digital asset in an ownership database, embed a digital watermark into the digital asset to generate a digitally watermarked digital asset, and provide, to the user, the digitally watermarked digital asset. The digital watermark embedded in the digitally watermarked digital asset and the record of ownership of the digital asset in the ownership database enable ownership verification of the digital asset.
    Type: Application
    Filed: July 18, 2023
    Publication date: April 11, 2024
    Inventors: Hui Li, Bin Feng, Ni Chia Koay, Chen Hu Wu
  • Publication number: 20240117043
    Abstract: The present disclosure provides a bispecific antibody including a binding domain that binds to CD112R and a binding domain that binds to TIGIT, and the binding domain that binds to CD112R includes: HCDR1, HCDR2 and HCDR3 of the amino acid sequence set forth in SEQ ID NO: 1, and/or LCDR1, LCDR2 and LCDR3 of the amino acid sequence set forth in SEQ ID NO: 2; and the HCDR1, HCDR2, HCDR3, LCDR1, LCDR2 and LCDR3 are defined according to the Kabat, IMGT, Chothia, AbM or Contact numbering system. The present disclosure further provides a polynucleotide encoding the antibody, an expression vector, a host cell and a method for expressing and purifying the antibody, a pharmaceutical composition including the antibody of the present disclosure, and use of the bispecific antibody for treating cancer.
    Type: Application
    Filed: August 4, 2023
    Publication date: April 11, 2024
    Applicants: SHANGHAI JUNSHI BIOSCIENCES CO., LTD., SUZHOU JUNMENG BIOSCIENCES CO., LTD.
    Inventors: Dandan LIU, Jinwei ZHOU, Yuehua ZHOU, Jing ZHANG, Sheng YAO, Hui FENG, Hui LIU, Hongchuan LIU, Li LI, Qiang ZHAO
  • Patent number: 11955774
    Abstract: Provided is an elliptical multi-mesa laser structure, including a substrate layer, an N-DBR, a functional layer and a P-DBR sequentially arranged from bottom to top. The substrate layer is fixedly connected with an N contact layer. The N-DBR is fixedly connected to a top of the substrate layer, and the N contact layer is arranged around the N-DBR. A space layer is inserted in the N-DBR. The functional layer is fixedly connected to a top of the N-DBR. The P-DBR is fixedly connected to a top of the functional layer, and a top of the P-DBR is fixedly connected with a P contact layer. Another space layer is inserted into the P-DBR.
    Type: Grant
    Filed: July 1, 2023
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN TECHNOLOGY UNIVERSITY
    Inventors: Hui Li, Jian Feng, Chuyu Zhong, Wei Miao, Shilong Zhao, Zhao Chen
  • Patent number: 11955579
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: April 9, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
  • Patent number: 11949040
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: April 2, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
  • Patent number: 11934106
    Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Yen Liu, Hui-Fang Kuo, Chian-Ting Huang, Wei-Cyuan Lo, Yung-Feng Cheng, Chung-Yi Chiu
  • Publication number: 20240087951
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen
  • Publication number: 20240077631
    Abstract: The present disclosure relates to a seismic imaging free gas structure identification method and system, The method includes: acquiring a seismic imaging dataset, and annotating free gas structures in the seismic imaging sample data set to obtain a training dataset; using a generative adversarial network (GAN) to expand the training dataset for network training, wherein the GAN includes a generative network and a discrimination network; conducting domain conversion on original label data of the free gas training samples to obtain annotating labels: training a Bayesian neural network according to the free gas training datasets and labels, to obtain a free gas structure identification model; acquiring actual seismic imaging data of a target work area; and conducting, according to the actual seismic imaging data, identification by using the free gas structure identification model.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 7, 2024
    Applicant: Institute of Geomechanics, Chinese Academy of Geological Sciences
    Inventors: Hao ZHANG, Chongyuan ZHANG, Xingqiang FENG, Hui SHI
  • Patent number: 11919453
    Abstract: The present disclosure provides a vehicle positioning device for vehicle vision calibration, a positioning adjustment method, and a positioning adjustment system. The vehicle positioning device includes a base, a chassis, a translation mechanism and a rotation mechanism. A to-be-calibrated vehicle is placed onto the chassis, and the chassis is provided with a stopper. The translation mechanism is arranged between the chassis and the base, and configured to drive the chassis to move in an X-axis direction in a three-dimensional coordinate system relative to the base in accordance with a translation control instruction. The rotation mechanism is arranged between the chassis and the base, and configured to drive the chassis to rotate about a Z-axis in the three-dimensional coordinate system relative to the base in accordance with a rotation control instruction.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: March 5, 2024
    Assignee: Beijing Smarter Eye Technology Co. Ltd.
    Inventors: Ran Meng, Hua Chai, Yanqiu Xia, Zunying Pang, Zhe Wang, Yong Jia, Hui Cai, Chuanbin Feng