Patents by Inventor Hui-Huan Chien

Hui-Huan Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11832378
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
  • Publication number: 20230143361
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 11, 2023
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
  • Publication number: 20230029463
    Abstract: A connector in an information handling system includes a battery connector, a battery receptacle, and a signal pin structure contact. The battery connector includes a first set of power pins and a first set of signal pins. The battery receptacle includes a second set of power pins and a second set of signal pins. The first and second sets of power pins are coupled together when the battery connector is inserted within the battery receptacle. The signal pin structure contact transitions between an open position and a closed position. The signal pin structure contact couples the first and second sets of signal pins when the signal pin structure contact is in the closed position. A power down signal is provided to components of the information handling system when the signal pin structure contact is in the open position.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventors: Chia-Fa Chang, Chia-Liang Lin, Shao-Szu Ho, Chien-Hao Chiu, Hui-Huan Chien