Abstract: A semiconductor device includes a fin structure, a first conductive line, a second conductive line and a first conductive rail. The fin structure is disposed on a substrate. The first conductive line is arranged to wrap a first portion of the fin structure. The second conductive line is attached on a second portion of the fin structure. The second portion is different from the first portion. The first conductive rail is disposed in a same layer as the first conductive line and the second conductive line on the substrate. The first conductive rail is attached on one end of the first conductive line and one end of the second conductive line for electrically connecting the first conductive line and the second conductive line.

Abstract: A system for manufacturing an integrated circuit includes a processor coupled to a non-transitory computer readable medium configured to store executable instructions. The processor is configured to execute the instructions for generating a layout design of the integrated circuit that has a set of design rules. The generating of the layout design includes generating a set of gate layout patterns corresponding to fabricating a set of gate structures of the integrated circuit, generating a cut feature layout pattern corresponding to a cut region of a first gate of the set of gate structures of the integrated circuit, generating a first conductive feature layout pattern corresponding to fabricating a first conductive structure of the integrated circuit, and generating a first via layout pattern corresponding to a first via. The cut feature layout pattern overlaps a first gate layout pattern of the set of gate layout patterns.

Abstract: A tumble dryer includes a housing, which has an enclosable drying chamber, a heater mounted in the enclosable drying chamber, a gate for closing/opening the enclosable drying chamber and a tumbler rotatably mounted in the drying chamber, an intake pipeline equipped with an intake control valve for guiding outside air into the drying chamber, an exhaust pipeline equipped with an exhaust control valve for guiding air out of the drying chamber to the atmosphere, an air-suction pipeline equipped with a pipeline control valve and having a pump installed therein for pumping air out of the drying chamber to the atmosphere.

Abstract: A refrigeration system includes a refrigeration housing having an enclosed evaporation chamber and a water storage structure formed of a water pan or water pans, a water-filling pipeline extending from the outside the refrigeration housing to the evaporation chamber for guiding water to each water pan and having installed therein a water intake control valve controllable to open/close the water-filling pipeline, an air-intake pipeline extending from the outside of the refrigeration housing to the evaporation chamber and having installed therein an air-intake control valve controllable to open/close the air-intake pipeline, one or a number of heat sink pipelines extending from the outside of the refrigeration housing to each water pan for heat exchange with the storage water, and an exhaust pipeline extending from the outside of the refrigeration housing to the evaporation chamber and having installed therein a pump controllable to draw air out of the evaporation chamber.

Abstract: A tumble dryer includes a housing, which has an enclosable drying chamber, a heater mounted in the enclosable drying chamber, a gate for closing/opening the enclosable drying chamber and a tumbler rotatably mounted in the drying chamber, an intake pipeline equipped with an intake control valve for guiding outside air into the drying chamber, an exhaust pipeline equipped with an exhaust control valve for guiding air out of the drying chamber to the atmosphere, an air-suction pipeline equipped with a pipeline control valve and having a pump installed therein for pumping air out of the drying chamber to the atmosphere.

Abstract: A mirror plate for rearview mirror is disclosed to include a primary vision block having opposing front and back sides and a reflective layer located on the front or back side for reflecting a major rear field of view, and one or a number of supplementary vision blocks abutted against a part or the whole area of the border of the primary vision block, each supplementary vision block having opposing front and back sides and multiple reflective layers continuously arranged on the front or back side for reflecting a supplementary rear field of view around the major rear field of view. The invention also provides a rearview mirror using the mirror plate.

Abstract: A light-emitting diode (LED) for both AlGaInP- and GaN-based materials needs a good transparent current spreading layer to disseminate electrons or holes from the electrode to the active layer. The present invention utilizes a conductive and transparent ITO (Indium Tin Oxide) thin film with an ultra-thin (to minimize the absorption) composite metallic layer to serve as a good ohmic contact and current spreading layer. The present invention avoids the Schottky contact due to direct deposition of ITO on the semiconductor. For AlGaInP materials, a thick GaP current spreading layer is omitted by the present invention. For GaN-based LEDs with the present invention, semi-transparent Ni/Au contact layer is avoided. Therefore, the light extraction of LED can be dramatically improved by the present invention. Holes may be etched into the semiconductor cladding layer forming a Photonic Band Gap structure to improve LED light extraction.

Abstract: A light-emitting diode (LED) for both AlGaInP- and GaN-based materials needs a good transparent current spreading layer to disseminate electrons or holes from the electrode to the active layer. The present invention utilizes a conductive and transparent ITO (Indium Tin Oxide) thin film with an ultra-thin (to minimize the absorption) composite metallic layer to serve as a good ohmic contact and current spreading layer. The present invention avoids the Schottky contact due to direct deposition of ITO on the semiconductor. For AlGaInP materials, a thick GaP current spreading layer is omitted by the present invention. For GaN-based LEDs with the present invention, semi-transparent Ni/Au contact layer is avoided. Therefore, the light extraction of LED can be dramatically improved by the present invention. Holes may be etched into the semiconductor cladding layer forming a Photonic Band Gap structure to improve LED light extraction.