Abstract: A method of forming a single-crystal group-III nitride is provided in the present invention. In some embodiments, the method includes the following steps. First, a molybdenum disulfide (MoS2) is formed on a remote substrate. Then, the MoS2 is transferred onto a substrate. Next, a sputtering operation is performed to epitaxially grow a single-crystal group-III nitride layer on the MoS2, so as to form the single-crystal group-III nitride layer on the substrate such as a Si substrate or a flexible substrate.

Abstract: A novel surface acoustic wave device with a decreased velocity dispersion and a low insertion loss as well as the fabrication method therefore is provided. The surface acoustic wave device includes a substrate, an insulating layer with an indentation on the substrate, a silicon layer divided by an etched window with a first portion on the insulating layer and a second portion suspended above the indentation, a piezoelectric layer on the first and the second portions of the silicon layer, and at least an electrode on the piezoelectric layer.

Abstract: A novel surface acoustic wave device with a decreased velocity dispersion and a low insertion loss as well as the fabrication method therefor is provided. The surface acoustic wave device includes a substrate, an insulating layer with an indentation on the substrate, a silicon layer with a first portion on the insulating layer and a second portion suspended above the indentation, a piezoelectric layer on the first and the second portions of the silicon layer, and at least an electrode on the piezoelectric layer.

Abstract: A novel surface acoustic wave device with a decreased velocity dispersion and a low insertion loss as well as the fabrication method therefor is provided. The surface acoustic wave device includes a substrate, an insulating layer with an indentation on the substrate, a silicon layer with a first portion on the insulating layer and a second portion suspended above the indentation, a piezoelectric layer on the first and the second portions of the silicon layer, and at least an electrode on the piezoelectric layer.

Abstract: A novel surface acoustic wave device with a decreased velocity dispersion and a low insertion loss as well as the fabrication method therefor is provided. The surface acoustic wave device includes a substrate, an insulating layer with an indentation on the substrate, a silicon layer with a first portion on the insulating layer and a second portion suspended above the indentation, a piezoelectric layer on the first and the second portions of the silicon layer, and at least an electrode on the piezoelectric layer.

Abstract: A thin film layered surface acoustic wave device includes a substrate, a GaN piezoelectric film, an AlN piezoelectric film and interdigital transducer electrodes. The GaN piezoelectric film is deposited on the substrate by chemical vapor deposition (CVD) or physical vapor deposition (PVD) method. Then the AlN piezoelectric film is deposited on top surface of the GaN piezoelectric film by the same way. Finally, the interdigital transducer electrodes are deposited on top surface of AlN piezoelectric film and form by etching of lift off method. Accordingly, high operating frequency and low loss surface acoustic wave devices can be produced which can be integrated with high frequency devices, such as HBT and HEMT, and different devices.