Abstract: The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size.

Abstract: The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size.