Patents by Inventor Hui W. Chen

Hui W. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8293460
    Abstract: Methods to pattern features in a substrate layer by exposing a photoresist layer more than once. In one embodiment, a single reticle may be exposed more than once with an overlay offset implemented between successive exposures to reduce the half pitch of the reticle. In particular embodiments, these methods may be employed to reduce the half pitch of the features printed with 65 nm generation lithography equipment to achieve 45 nm lithography generation CD and pitch performance.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: October 23, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Hui W. Chen, Chorng-Ping Chang, Yongmei Chen, Huixiong Dai, Jiahua Yu, Susie X. Yang, Xumou Xu, Christopher D. Bencher, Raymond Hoiman Hung, Michael P. Duane, Christopher Siu Wing Ngai, Jen Shu, Kenneth MacWilliams
  • Publication number: 20090311635
    Abstract: Methods to pattern features in a substrate layer by exposing a photoresist layer more than once. In one embodiment, a single reticle may be exposed more than once with an overlay offset implemented between successive exposures to reduce the half pitch of the reticle. In particular embodiments, these methods may be employed to reduce the half pitch of the features printed with 65 nm generation lithography equipment to achieve 45 nm lithography generation CD and pitch performance.
    Type: Application
    Filed: December 19, 2008
    Publication date: December 17, 2009
    Inventors: HUI W. CHEN, CHORNG-PING CHANG, YONGMEI CHEN, HUIXIONG DAI, JIAHUA YU, SUSIE X. YANG, XUMOU XU, CHRISTOPHER D. BENCHER, RAYMOND HOIMAN HUNG, MICHAEL P. DUANE, CHRISTOPHER SIU WING NGAI, JEN SHU, KENNETH MACWILLIAMS