Patents by Inventor Hui Wang Lin

Hui Wang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157823
    Abstract: The present disclosure provides a motor drive integrated on-board charger to reduce the quantity of components in an electric system of an electric vehicle. Reduction of components is achieved by utilizing the motor and the motor driving inverter as a part of the on-board charger in the charging mode. By controlling relays, electrical connections of the system may be reconfigured according to its mode of operation. In one aspect, the motor and the motor driving inverter play the roles of a boost PFC, a current regulator, or both.
    Type: Application
    Filed: March 18, 2022
    Publication date: May 16, 2024
    Inventors: Tomas Sadilek, Ruxi Wang, Satyaki Mukherjee, Hui-Hsin Lin, Chung-Hwa Wei, Peter Mantovanelli Barbosa
  • Patent number: 4794217
    Abstract: A semiconductor wafer is transported by a mechanical system into or out of a quartz housing filled with a protection gas. The wafer is placed between and spaced apart from two graphite plates. A RF induction coil surrounding the quartz housing is used to heat the graphite plates. Radiation from the heated graphite plates heats the wafer from room temperature to an elevated desired temperature. During the time period when a wafer absorbs radiation primarily through electron-to-electron transition, heat convection and conduction by the protection gas conveys heat from the graphite plates to the wafer to accelerate the heating of the wafer and reduces temperature nonuniformity of the wafer.
    Type: Grant
    Filed: April 15, 1987
    Date of Patent: December 27, 1988
    Assignee: Qing Hua University
    Inventors: Pei Xin Quan, Dong Yan Hou, Bi-Xian Chen, Teng Ge Ma, Hui Wang Lin, Zhi Jian Li