Patents by Inventor Hui Yang

Hui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122597
    Abstract: The A surgical apparatus including an adapter and a shaft assembly. The adapter includes a casing having an opening, and a rotary head sleeved onto the opening and configure d to be rotatable relative to the casing. The rotary head includes a first through hole and a first guide member disposed in the first through hole. The shaft assembly is detachably connected to the adapter, and includes a firing sleeve and a coupling component. The coupling component is configured to insert into the opening of the casing after passing through the first through hole of the rotary head. The couple component includes a coupling casing and a second guide member provided on the couple casing. The first guide member and the second guide member are engaged with each other in a snap-fit manner to maintain the rotary head and the shaft assembly in a locked position.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 18, 2024
    Inventors: Hui ZHANG, Ronghua XU, Bin YANG
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20240129575
    Abstract: The present disclosure relates to a live content presentation method and apparatus, an electronic device, and a readable storage medium. The method includes: receiving a trigger operation on a target entry; and in response to the trigger operation on the target entry, presenting a profile page of a target user, and in response to determining that the target user is on a live, presenting live preview content in a background image area comprised in the profile page, wherein the live preview content is generated in accordance with an image of a live room of the target user.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: Hui XUAN, Mengying FANG, Can YANG, Yijie LI
  • Publication number: 20240125826
    Abstract: A method for detecting a topological structure of a grounding grid under extremely cold condition, includes the following steps: in a substation in an extremely cold area, determining a measuring area S on a ground surface of a grounding grid according to the positions of branches and nodes of the grounding grid in a selected area, acquiring dynamic current values of the branches and nodes through a current sensor based on TMR tunnel magnetoresistance, and then indirectly acquiring the magnetic induction intensity of the measuring area S through conversion; calculating moduli of first to third derivatives of magnetic induction intensities; and determining specific positions and laying depths of the branches of the grounding grid according to peak distances between main lobe peaks and side peaks between strong peaks of the moduli. According to the method, the calculation amount is greatly reduced, and the detection method has strong anti-interference.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 18, 2024
    Applicant: CHONGQING UNIVERSITY
    Inventors: Ruotong MING, Fan YANG, Zhili LI, Tian TAN, Jihua GE, Hui JIANG, Zikang YANG
  • Publication number: 20240128498
    Abstract: A solid-state battery cell, a solid-state battery, and methods of making the same are disclosed. The solid-state battery cell includes a cathode current collector, a cathode on the cathode current collector, a low-impedance interface film on the cathode, a solid-state electrolyte on or over the low-impedance interface film, a lithiophilic layer on or over the solid-state electrolyte, and an anode current collector on or over the lithiophilic layer. The low-impedance interface film may include an oxide, a nitride or an oxynitride of lithium and a metal selected from aluminum, silicon and titanium, carbon, a metal oxide, fluoride, oxyfluoride or phosphate, or an alkali metal borate, and may have a thickness of 5-100 ?, for example. The lithiophilic layer may be or include a metal oxide, silicate, aluminate or fluoride, or an elemental metal or metalloid, and may have a thickness of 5 ? to 1 ?m, for example.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 18, 2024
    Applicant: Ensurge Micropower ASA
    Inventors: Arvind KAMATH, Shahid PIRZADA, Zhongchun WANG, Hui YANG
  • Publication number: 20240126446
    Abstract: Described herein are systems, methods, and software to manage multi-type storage in a cluster computing environment. In one example, a host can identify health and performance information at a first time for each local data store on the host and a hyperconverged data store available to the host. The host can further identify health and performance information associated with the data stores at a second time and can compare the health and performance information at the first time and the second time to identify differences in the information. The host then communicates the differences to a second host in the computing environment.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Inventors: Yang Yang, Yu Wu, Jin Feng, Hui Xu, Zhuocheng Shen, Rajesh Venkatasubramanian
  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Patent number: 11961919
    Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Chang, Hsiu-Hao Tsao, Ming-Jhe Sie, Shun-Hui Yang, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
  • Patent number: 11963263
    Abstract: A data forwarding method includes: receiving, by a session management function network element, information about a first bearer in a first network from an access and mobility management function network element; and sending flow information of a first flow in a second network and forwarding information to the access and mobility management function network element. The flow information indicates a flow for data forwarding, and the forwarding information is used for forwarding the first flow to a tunnel corresponding to the first bearer.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiao Yang, Yan Li, Hui Ni
  • Patent number: 11960869
    Abstract: An Android penetration method and device for implementing silent installation based on accessibility services. The method includes: acquiring a second target application by adding a load program to a first target application and adding penetration permissions using an Android decompilation technology; and implementing silent installation of the second target application using an accessibility service technology.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: April 16, 2024
    Assignee: Guangzhou University
    Inventors: Hui Lu, Zhihong Tian, Chengjie Jin, Luxiaohan He, Man Zhang, Jiageng Yang, Xinguo Zhang, Dongqiu Huang, Qi Sun, Yanbin Sun, Shen Su
  • Patent number: 11958942
    Abstract: The present disclosure provides a method for recycling urea-formaldehyde (UF) from a wood-based panel. In the present disclosure, the UF is depolymerized by an ultrasonic treatment, and depolymerized UF can be reused for UF manufacture and wood-based panel production. The recycled and treated UF can be repeatedly used in wood-based panel manufacture without affecting performances of the wood-based panel. UF-glued wood-based panels can be recycled, and a recycled wood-based panel raw material can replace at least 50% of a non-recycled wood-based raw material for particle board production without affecting performances of the wood-based panel.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: April 16, 2024
    Assignee: Southwest Forestry University
    Inventors: Hui Wan, An Mao, Hong Lei, Xiaojian Zhou, Zhi Li, Long Yang, Linkun Xie, Guanben Du
  • Publication number: 20240119335
    Abstract: Disclosed are a quantum chip, a quantum computer, and a fabrication method for a quantum chip. The quantum chip includes a substrate and an adapter plate, at least one qubit is formed on the substrate, signal transmission lines are formed on the adapter plate, and the signal transmission lines are electrically connected to the at least one qubit.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicant: Origin Quantum Computing Technology (Hefei) Co., Ltd
    Inventors: Hui YANG, Ye LI
  • Publication number: 20240114967
    Abstract: An electronic-cigarette rod includes a housing having an insertion opening and a support in the housing. The support includes a receiving cavity for receiving a sensor, an air inlet channel in communication with the receiving cavity, an airflow channel defined by an outer peripheral wall of the support and in air communication with an exterior of the support, and a first opening. The support further includes an end surface facing the insertion opening, the air inlet channel is located on a side of the receiving cavity close to the end surface. A first end of the first opening is in communication with the airflow channel, a second end of the first opening is in communication with the air inlet channel, and the air inlet channel is in air communication with the exterior of the support through the first opening and the airflow channel in that sequence.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: HUI WANG, Sheng-Yang Xu
  • Publication number: 20240120399
    Abstract: Provided are multi-gate devices and methods for fabricating such devices. An exemplary method includes forming gate structures over a semiconductor material, wherein the gate structures include a long channel (LC) gate structure and a short channel (SC) gate structure; forming a patterned mask over the semiconductor material, wherein the LC gate structure and the SC gate structure are not covered by the patterned mask; and performing an etch process on the LC gate structure and on the SC gate structure through the patterned mask to remove the LC gate structure and the SC gate structure, wherein removal of the LC gate structure forms a deep trench in the semiconductor substrate having a first depth, and wherein removal of the SC gate structure forms a shallow trench in the semiconductor substrate having a second depth less than the first depth.
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Shun-Hui Yang
  • Publication number: 20240115597
    Abstract: The present disclosure provides a method for treating and/or preventing hearing loss by using a Toll-like receptor 7 and/or 9 antagonist. The Toll-like receptor 7 and/or 9 antagonist of the present disclosure achieves the effect of treating and/or preventing hearing loss by attenuating noise-induced increased gene expression of cytokines and chemokines in the cochlea, attenuating the noise-induced increase of nuclear factor kappa-B expression in the cochlea, and decreasing noise-induced macrophage infiltration into the cochlea.
    Type: Application
    Filed: August 1, 2023
    Publication date: April 11, 2024
    Inventor: Chao-Hui Yang
  • Publication number: 20240121997
    Abstract: Provided are a display substrate, a preparation method thereof and a display apparatus. The display substrate includes a first semi-conductive layer, a first conductive layer, a second conductive layer, a second semi-conductive layer, a third conductive layer, an interlayer insulating layer and an organic layer stacked on a substrate. The first semi-conductive layer includes an active layer of a polysilicon transistor, the first conductive layer includes a gate electrode of a polysilicon transistor and a first electrode plate of a storage capacitor, the second conductive layer includes a second electrode plate of a storage capacitor, the second semi-conductive layer includes an active layer of an oxide transistor, and the third conductive layer includes a gate electrode of an oxide transistor.
    Type: Application
    Filed: April 28, 2021
    Publication date: April 11, 2024
    Inventors: Xiaoqi DING, Peng HUANG, Ke LIU, Tao GAO, Xinlei YANG, Guoyi CUI, Zeliang LI, Hui LU
  • Patent number: 11956416
    Abstract: An image sensing device may include a plurality of test pixel blocks and a signal processing unit. The test pixel blocks may be simultaneously heated to different temperatures. The signal processing unit may be in communication with the test blocks and configured to obtain pixel signals for different colors, respectively, based on dark current information associated with the temperatures of the test pixel blocks.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 9, 2024
    Assignee: SK HYNIX INC.
    Inventor: Yun Hui Yang
  • Patent number: 11957023
    Abstract: A light-emitting diode display panel, a manufacturing method thereof, and an organic light-emitting diode display device are provided. The light-emitting diode display panel includes: a base substrate including a display region and a peripheral region surrounding the display region; a plurality of sub-pixels located in the display region and located at a side of the base substrate; a color-resistance layer located at a side of a second electrode in the sub-pixel away from the base substrate; and a light-blocking structure located in the peripheral region and being an annular structure surrounding the plurality of sub-pixels. The light-blocking structure includes a first light-blocking structure and a second light-blocking structure. The first light-blocking structure includes at least one interval extending in a direction from the display region pointing to the peripheral region. The second light-blocking structure at least fully fills the interval.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: April 9, 2024
    Inventors: Dongsheng Li, Kuanta Huang, Shengji Yang, Pengcheng Lu, Yunlong Li, Qing Wang, Yongfa Dong, Xiaobin Shen, Hui Tong, Xiong Yuan, Yu Wang, Xiaochuan Chen
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11953379
    Abstract: A live detection system, a thermal infrared (IR) imager and a method for power grid equipment are provided. The system includes an environmental parameter module for acquiring environmental temperature, humidity and wind speed data; a ranging module for measuring a linear distance to the power grid equipment; an equipment type recognition module for acquiring an image of the power grid equipment, and recognizing a type of the power grid equipment; an equipment material determination module for determining a material type of the power grid equipment; an emissivity setting module for setting an emissivity; an temperature measurement module for obtaining a temperature of the power grid equipment by focusing on positions of the power grid equipment which need temperature measurement; and a report generation module for selecting a corresponding diagnostic model, displaying a temperature measurement position and a temperature value, drawing a conclusion, and generating a report.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: April 9, 2024
    Assignees: State Grid Shandong Electric Power Research Institute, State Grid Corporation of China
    Inventors: Rong Liu, Hui Liu, Qinghe Shen, Jinxia Yao, Haiyan Yuan, Bo Yang, Xiaobin Sun, Chao Gu, Ran Jia, Yang Zhang, Chao Zhou, Chuanbin Liu