Patents by Inventor Huijun LAN

Huijun LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform
    Patent number: 11752581
    Abstract: The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: September 12, 2023
    Assignee: CAMBRICON TECHNOLOGIES CORPORATION LIMITED
    Inventors: Chongxing Zhu, Huijun Lan, Kun He, Kai Ye, Deheng Chen, Shuai Chen
  • MULTI-PURPOSE HEAT SINK, METHOD OF MANUFACTURING THE SAME, BOARD CARD, AND MULTI-PURPOSE HEAT SINK PLATFORM
    Publication number: 20200376614
    Abstract: The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.
    Type: Application
    Filed: December 13, 2019
    Publication date: December 3, 2020
    Inventors: Chongxing ZHU, Huijun LAN, Kun HE, Kai YE, Deheng CHEN, Shuai CHEN
  • HEAT DISSIPATION DEVICE AND BOARD CARD
    Publication number: 20200363135
    Abstract: The present disclosure provides a heat dissipation device and a board card. The heat dissipation device includes a fin group provided with a plurality of heat dissipation fins, and a heat pipe group provided with at least one heat pipe. The fin group is wholly located on one side of the heat pipe group in a first direction. The heat dissipation device and the board card have high heat dissipation efficiency.
    Type: Application
    Filed: December 13, 2019
    Publication date: November 19, 2020
    Inventors: Kun HE, Huijun LAN, Chongxing ZHU, Jun HE, Zhihang ZHANG, Kai YE, Deheng CHEN, Shuai CHEN