Abstract: An integrated acoustic detection and rock direct tensile test machine includes a support frame. A top of the support frame is provided with a top plate and a bearing plate is provided above the top plate. The bearing plate is provided with force transferring rods, lower ends of which are provided with a tensile base. A top of the tensile base is provided with a lower clamp holder and a bottom of the top plate is provided with an upper clamp holder. An upper channel is provided inside the upper clamp holder. The upper channel is provided with an acoustic transmitting probe. A lower channel is provided inside the lower clamp holder. One end of the lower channel is communicated with the outside, the other end is provided with an acoustic receiving probe. The lower channel extends to a bottom of a clamping chamber of the lower clamp holder.

Abstract: A clamping triaxial seepage and acoustic coupling rock tensile testing machine includes a sample and a scaffold-type tensile testing device. The scaffold-type tensile testing device has an upper chuck and a lower chuck. The upper chuck has an acoustic transmitting channel, one end of which communicating with the outside, and the other end of which having an acoustic transmitting probe. The lower chuck has an acoustic receiving channel, one end of which communicating with the outside, and the other end having acoustic receiving probe. An upper end face of the sample has with a seepage outflow hole while the upper chuck has a seepage outflow channel connected with the seepage outflow hole. A lower end face of the sample has a seepage inflow hole while the lower chuck has a seepage entry channel is connected with the seepage inflow hole.

Abstract: A rock direct tensile test platform suitable for all material test machines includes a support frame. A top of the support frame is fixed with a top plate, and a bearing plate is provided above the top plate. The bearing plate is provided with a plurality of vertical force transferring rods. The force transferring rods vertically penetrate through the top plate and have a sliding fit with the top plate. Lower ends of the force transferring rods are provided with a tensile base. A top of the tensile base is provided with a lower clamp holder. A bottom of the top plate is provided with an upper clamp holder, and a clamp center of the upper clamp holder coincides with a clamp center of the lower clamp holder.

Abstract: A method and apparatus for temperature sensing in an IC. The IC includes a plurality of remote temperature sensors each coupled to a control logic unit. The plurality of remote temperature sensors may be distributed throughout the integrated circuit. The integrated circuit includes a reference unit coupled to provide a reference temperature to the control logic unit and a reference sensor coupled to provide a signal having a reference frequency to the control logic unit. The reference unit and the reference sensor are located near each other. The control logic unit is configured to correlate the reference frequency received from the reference sensor with the reference temperature received from the reference unit. The control logic unit is further configured to determine the temperature of each of the remote temperature sensors based on this correlation, and also configured to determine the maximum temperature of all of the temperature sensors.

Abstract: A method and apparatus for temperature sensing in an IC. The IC includes a plurality of remote temperature sensors each coupled to a control logic unit. The plurality of remote temperature sensors may be distributed throughout the integrated circuit. The integrated circuit includes a reference unit coupled to provide a reference temperature to the control logic unit and a reference sensor coupled to provide a signal having a reference frequency to the control logic unit. The reference unit and the reference sensor are located near each other. The control logic unit is configured to correlate the reference frequency received from the reference sensor with the reference temperature received from the reference unit. The control logic unit is further configured to determine the temperature of each of the remote temperature sensors based on this correlation, and also configured to determine the maximum temperature of all of the temperature sensors.

Abstract: An integrated circuit includes a first temperature sensing device providing an indication of a sensed temperature, a correlation oscillator circuit positioned adjacent to the first temperature sensing device, a plurality of other oscillator circuits, and storage locations storing calibration factors associated with at least the first temperature sensing device and the plurality of other oscillator circuits. A temperature calculation circuit determines temperatures of various locations in the integrated circuit. Each of the temperatures is determined according to an oscillation frequency of a respective one of the other oscillators, the oscillation frequency of the correlation ring oscillator, the temperature of the first temperature sensing device, and one or more stored calibration factors.

Abstract: An integrated circuit includes a first temperature sensing device providing an indication of a sensed temperature, a correlation oscillator circuit positioned adjacent to the first temperature sensing device, a plurality of other oscillator circuits, and storage locations storing calibration factors associated with at least the first temperature sensing device and the plurality of other oscillator circuits. A temperature calculation circuit determines temperatures of various locations in the integrated circuit. Each of the temperatures is determined according to an oscillation frequency of a respective one of the other oscillators, the oscillation frequency of the correlation ring oscillator, the temperature of the first temperature sensing device, and one or more stored calibration factors.