Patents by Inventor Huiyun Huang

Huiyun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Permanent packer and extended gas lift method using permanent packer
    Patent number: 11994011
    Abstract: The present invention discloses a permanent packer and an extended gas lift method using the permanent packer, the method comprising: S1. imbedding the extended gas lift embedded pipe when setting the permanent packer, wherein the extended gas lift embedded pipe has an upper end being closed and a lower end being open, is provided therein with a one-way valve through which the fluid can pass from top to bottom; S2. lowering a breaking device from the production casing when in the extended gas lift, to break the upper end of the extended gas lift embedded pipe such that the upper and lower ends of the extended gas lift embedded pipe are communicated; and S3. injecting gas into the production casing, lifting the accumulated liquid in the bottom hole to the ground surface, to complete the extended gas lift.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 28, 2024
    Assignees: PetroChina Company Limited, Sichuan Shengnuo Oil. and Gas Engineering Technology Service Co. Ltd
    Inventors: Weilin Wang, Huiyun Ma, Changqing Ye, Hao Tan, Hanbing Tang, Daogang Cai, Xueqiang Wang, Yukui Hong, Fengjing Sun, Wei Zhou, Ting Zhang, Zonghao Dong, Yan Huang, Yun Miao
  • BIPHENYL COMPOUND AS IMMUNOMODULATOR, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
    Publication number: 20240109919
    Abstract: The present invention disclosure also relates to a pharmaceutical composition that ccomprises the compound as an active ingredient.
    Type: Application
    Filed: November 15, 2023
    Publication date: April 4, 2024
    Inventors: Qianjiao Yang, Song Shan, Lijun Xin, Desi Pan, Xiaoliang Wang, Yonglian Song, Yu Zhang, Huiyun Huang, Qi Wei, Zhibin Li, Xianping Lu
  • Biphenyl compound as immunomodulator, preparation method therefor and application thereof
    Patent number: 11866452
    Abstract: A biphenyl compound represented by formula (I), a preparation method therefor and an application thereof. The present invention also relates to a pharmaceutical composition that comprises the compound as an active ingredient. The compound is a novel small molecule immunomodulator having excellent oral absorption features and can be used for treating and/or preventing various immunity-related diseases.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: January 9, 2024
    Assignee: Shenzhen Chipscreen Biosciences Co., Ltd.
    Inventors: Qianjiao Yang, Song Shan, Lijun Xin, Desi Pan, Xiaoliang Wang, Yonglian Song, Yu Zhang, Huiyun Huang, Qi Wei, Zhibin Li, Xianping Lu
  • BIPHENYL COMPOUND AS IMMUNOMODULATOR, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
    Publication number: 20230365590
    Abstract: A biphenyl compound represented by formula (I), a preparation method therefor and an application thereof. The present invention also relates to a pharmaceutical composition that comprises the compound as an active ingredient. The compound is a novel small molecule immunomodulator having excellent oral absorption features and can be used for treating and/or preventing various immunity-related diseases.
    Type: Application
    Filed: October 28, 2021
    Publication date: November 16, 2023
    Inventors: Qianjiao Yang, Song Shan, Lijun Xin, Desi Pan, Xiaoliang Wang, Yonglian Song, Yu Zhang, Huiyun Huang, Qi Wei, Zhibin Li, Xianping Lu