Patents by Inventor Hul Chun Hsu

Hul Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7900353
    Abstract: A method for combining axially heated heat pipes and a heat-conducting base includes the steps of preparing a heat-conducting base and a plurality of heat pipes, providing a plurality of penetrating holes on a surface of the heat-conducting base, inserting one end of each heat pipe into the individual penetrating hole of the heat-conducting base, performing a lateral pressing to the heat-conducting base so as to bring each heat pipe into a tight and planar contact with the wall of each corresponding penetrating hole in the direction of pressing, and grinding the bottom surface of the heat-conducting base to become a flat surface to make the end of each heat pipe flush with the bottom surface of the heat-conducting base.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: March 8, 2011
    Assignee: Jaffe Limited
    Inventor: Hul-Chun Hsu
  • Patent number: 7849598
    Abstract: A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, the recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; and applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with the inner wall of its corresponding cambered space in the direction of pressing.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: December 14, 2010
    Assignee: Jaffe Limited
    Inventor: Hul-Chun Hsu
  • Patent number: 7823286
    Abstract: A wick structure of a heat pipe includes two elongated stripe-like continuous woven meshes and a plurality of fibers. A method for disposing the wick structure includes the steps of: providing a heat pipe body for accommodating the two meshes and the fibers; stacking up the two meshes so as to bundle and dispose the fibers between the two meshes; curling one end of the two meshes along a width direction, thereof; penetrating a pulling rod into an opening of one end of the heat pipe body, connecting the end of the two meshes together by means of the pulling rod, penetrating out of an opposing end of the heat pipe body so as to curl the two meshes within the heat pipe body, and the fibers being located on an axial stripe-like region within the heat pipe body; and cutting both ends of the heat pipe body.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: November 2, 2010
    Assignee: Jaffe Limited
    Inventor: Hul-Chun Hsu
  • Publication number: 20100193161
    Abstract: A wick structure of a heat pipe is constituted of woven meshes and fibers. The wick structure is constituted of two stacked layers of woven meshes and a plurality of fibers. The two woven meshes are adhered to the inner wall face of the heat pipe body, and each fiber is sandwiched between the two woven meshes and located on an axial stripe-like region within the heat pipe body. With a pulling rod, the woven meshes and the fibers can be driven to penetrate through the heat pipe body, so that the wick structure can be smoothly disposed into the heat pipe body.
    Type: Application
    Filed: April 12, 2010
    Publication date: August 5, 2010
    Inventor: Hul-Chun HSU
  • Patent number: 7650915
    Abstract: A method for removing vapor within a heat pipe includes providing a predetermined amount of working fluid injected into the heat pipe. An opening is reserved at one end of the heat pipe. The opening is communicated with a vacuum environment. The communication between the opening and the vacuum environment is normally disconnected, such that at the instant the communication is connected ,the vacuum level of the vacuum environment is maintained at a certain range. The communication between the opening of the heat pipe and the vacuum environment is intermittently connected for several times. Within the duration while the communication between the opening and the vacuum environment is connected, the working fluid is evaporated without being boiled and vapor is exhausted from the opening.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: January 26, 2010
    Inventor: Hul-Chun Hsu
  • Publication number: 20090072534
    Abstract: A sealed structure of a circular tubular heat pipe is formed on a distal opening of a heat pipe. A pressed recess portion recessed inwards from one side of a wall portion is formed on the distal opening. The wall portion of the distal opening is pressed from the pressed recess portion to the other side of the wall portion and is sealed therewith, thereby forming a flattened section of the heat pipe. The flattened section deflects toward one side of the body of the heat pipe, and it has two wing portions bending obliquely toward the pressed recess portion. The tip of one of the wing portions is brought into contact with the outside of the tip of the other wing portion, so that the flattened section forms a curled portion that reduces gradually from bottom to top.
    Type: Application
    Filed: November 20, 2008
    Publication date: March 19, 2009
    Inventor: Hul-Chun HSU
  • Publication number: 20080185127
    Abstract: A wick structure of a heat pipe is constituted of woven meshes and fibers. The wick structure is constituted of two stacked layers of woven meshes and a plurality of fibers. The two woven meshes are adhered to the inner wall face of the heat pipe body, and each fiber is sandwiched between the two woven meshes and located on an axial stripe-like region within the heat pipe body. With a pulling rod, the woven meshes and the fibers can be driven to penetrate through the heat pipe body, so that the wick structure can be smoothly disposed into the heat pipe body.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Inventor: Hul-Chun HSU
  • Publication number: 20080105405
    Abstract: A heat pipe multilayer capillary wick support structure includes a hollow pipe body, a first capillary wick and a second capillary wick in the pipe body, and an auxiliary transmission structure attached between the first and second capillary wicks; wherein the auxiliary transmission structure is composed of a plurality of running plates extended axially along the pipe body and separated parallelly with each other, and a plurality of connecting ribs connected between the running plates for forming a plurality of slender steam passages on the auxiliary transmission structure, so as to constitute a heat pipe multilayer capillary wick support structure to fit bend pipes and increase the capillary force.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Inventor: Hul-Chun Hsu
  • Patent number: 7354193
    Abstract: A clamping device with flexible contact for heat pipe includes a clamping body and a thermal couple wire. The clamping body includes a clamping section formed by at least two claws. The thermal couple wire has one end enclosing a pressing element and includes a temperature-sensing head at end of the pressing element. A first clamping block is provided on the claw and comprises an accommodating space. An opening is defined at end of the accommodating space near the first clamping block. The pressing element is elastically pressed in the accommodating space such that the temperature-sensing head is exposed out of the opening.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: April 8, 2008
    Assignee: Jaffe Limited
    Inventor: Hul-Chun Hsu
  • Publication number: 20080047140
    Abstract: A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, the recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; and applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with the inner wall of its corresponding cambered space in the direction of pressing.
    Type: Application
    Filed: August 17, 2006
    Publication date: February 28, 2008
    Inventor: Hul-Chun Hsu
  • Publication number: 20080047139
    Abstract: A method for combining axially heated heat pipes and a heat-conducting base includes the steps of preparing a heat-conducting base and a plurality of heat pipes, providing a plurality of penetrating holes on a surface of the heat-conducting base, inserting one end of each heat pipe into the individual penetrating hole of the heat-conducting base, performing a lateral pressing to the heat-conducting base so as to bring each heat pipe into a tight and planar contact with the wall of each corresponding penetrating hole in the direction of pressing, and grinding the bottom surface of the heat-conducting base to become a flat surface to make the end of each heat pipe flush with the bottom surface of the heat-conducting base.
    Type: Application
    Filed: August 17, 2006
    Publication date: February 28, 2008
    Inventor: Hul-Chun Hsu
  • Publication number: 20080035313
    Abstract: A isothermal plate includes a heat-conducting base and a plurality of heat pipe. After the heat-conducting base is combined with the heat pipes, they are subjected to a pressing action. The heat-conducting base has a first plate body provided thereon with a plurality of hollow ribs extending from its one side to another side. The hollow rib is arranged at an interval with each other, so that a hollowed section is formed between any two adjacent hollow ribs. Each hollow rib is provided therein with a deep hole extending along its lengthwise direction, so that the heat pipes are respectively inserted into each deep hole and accommodated therein.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 14, 2008
    Inventor: Hul-Chun Hsu
  • Publication number: 20080035310
    Abstract: An isothermal plate module includes an isothermal plate body and a plurality of heat pipes. One surface of the isothermal plate body has first recesses extending along a first direction and second recesses extending along a second direction. The first recesses extending along the first direction and the second recesses extending along the second direction are staggered to one another. A level difference is formed between each first and second recess. The heat pipes can be disposed in the first recesses and the second recesses, respectively. The isothermal plate body adheres to the heat source. With the plurality of staggered heat pipes and the working fluid and capillary structure within the heat pipes, an isothermal plate module can be formed.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 14, 2008
    Inventor: Hul-Chun Hsu
  • Patent number: 7322402
    Abstract: A method for fabricating a heat pipe structure which includes a tubular member, and a woven wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member. Therefore, an end portion of a heat pipe can be used to contact a heat source for dissipation to provide more efficient dissipation and prevent from limitation of use.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: January 29, 2008
    Inventor: Hul-Chun Hsu
  • Publication number: 20070246510
    Abstract: A rotating type soldering device is used for soldering a heat pipe and includes a transmission mechanism having a transmission platform on which heat pipes are disposed and transmitted. A rotation mechanism and a material-sending mechanism are arranged on topside and bottom side of the transmission platform The rotation mechanism includes a pair of rolling wheels rotated in the same direction. The material-sending mechanism includes a feeding rod used to push the heat pipe to move toward the rolling wheels and drive the heat pipe to have rotational contact with the rolling wheels. A solder mechanism is arrange on one side of the heat pipe and includes a solder gun corresponding to one end of the heat pipe and having a height difference with the transmission platform. The solder gun solders an opening of the heat pipe when the heat pipe is in rotational contact with the rolling wheels.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 25, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070235499
    Abstract: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism and a soldering mechanism. The rotation mechanism includes an actuator and a pair of wheels driven by the actuator. The wheels are conductive and electrically connected to a first electrode. The heat pipe is arranged between the wheels and in rotational contact with the wheels. The soldering mechanism is arranged on one side of the rotation mechanism and includes a solder gun corresponding to a first end of the heat pipe. The solder gun is electrically connected to a second electrode and used to seal an opening end of the heat pipe. The electrical arc is intense and the thermal deform of heat pipe is small.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070234566
    Abstract: A method for adhering a heat pipe wall and a wick structure includes the steps of preparing at least one layer of wick structure; attaching an appropriate amount of metal powder on the wick structure; placing the wick structure into a hollow heat pipe body; supporting the wick structure at an internal wall of the pipe body; sintering the metal powder as an adhesive for the pipe body and the wick structure, so that the wick structure is adhered onto the internal wall of the pipe body by the metal powder, while fibers of the wick structure are cohered with each other by the metal powder to enhance the effect of adhering the wick structure onto the pipe wall without affecting the original capillary attraction and transmission of the wick structure.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 11, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070235498
    Abstract: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism. The rotation mechanism includes an actuator and a plurality of wheels. The heat pipe is arranged between the wheels. A soldering mechanism with a solder gun is arranged on one side of the rotation mechanism. The solder gun is corresponding to one side of the heat pipe and electrically connected to a first electrode. A pressing mechanism with a pressing plate is arranged atop the wheels. One end of the pressing plate is pressed against one side of the heat pipe and another side of the pressing plate is electrically connected to a second electrode. The electrical arc is intense and the thermal deform of heat pipe is small.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070235497
    Abstract: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism. The rotation mechanism includes an actuator and a plurality of wheels. The heat pipe is arranged between the wheels. A soldering mechanism with a solder gun is arranged on one side of the rotation mechanism. The solder gun is corresponding to one side of the heat pipe and electrically connected to a first electrode. A liquid-supplying mechanism is arranged atop the wheels. The liquid-supplying mechanism is electrically connected to a second electrode, which has different polarity with the first electrode. Therefore, the liquid-supplying mechanism can supply electrically conductive liquid to an exterior portion of the heat pipe. The electrical arc is intense and the thermal deform of heat pipe is small.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070228116
    Abstract: A method for adhering a heat pipe wall and a wick structure includes the steps of preparing a hollow heat pipe body; placing at least one layer of wick structure at an internal wall of the pipe body; putting an appropriate quantity of metal powder in the pipe body so that the metal powder is attached to the wick structure; sintering the metal powder to be used as an adhesive for the pipe body and the wick structure, so that the wick structure is adhered onto the internal wall of the pipe body by the metal powder, and fibers of the wick structure are cohered with each other by the metal powder to enhance the effect of adhering the wick structure onto the pipe wall without affecting the original capillary attraction and transmission of the wick structure.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventor: Hul-Chun Hsu