Patents by Inventor Hung Chao

Hung Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174779
    Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.
    Type: Application
    Filed: January 3, 2023
    Publication date: May 30, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu, HungFan Lee
  • Publication number: 20240174810
    Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chi-Lin Chen
  • Publication number: 20240174849
    Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
  • Patent number: 11996058
    Abstract: A display device is provided and includes a display panel, a light source, a light source controller, and a timing controller. The light source is adjacent to the display panel. The light source controller is electrically connected to the light source. The timing controller is electrically connected to the light source controller and the display panel. The timing controller includes a decoding unit and first and second processing units. The first processing unit is electrically connected to the decoding unit and the display panel. The second processing unit is electrically connected to the decoding unit and the light source controller. The decoding unit provides a refresh signal to the first and second processing units so that the display panel refreshes displayed content in a first refresh sequence according to first refresh rates, and the light source refreshes brightness in a second refresh sequence according to second refresh rates.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 28, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Huang-Chi Chao, Wei-Cheng Tsai, Ming-Chi Weng, Yu-Hsin Feng, Cheng-Tso Hsiao, Ming-Feng Hsieh, Chien-Hung Chan
  • Patent number: 11996375
    Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung-Chih Chen
  • Publication number: 20240166874
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166844
    Abstract: A resin composition and use thereof, wherein the resin composition includes a resin base, an inorganic filler and a siloxane coupling agent. The resin base includes bismaleimide resins, benzoxazine resins, and naphthenic epoxy resins, and the inorganic filler includes strontium titanate or calcium-doped strontium titanate.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166781
    Abstract: A modified dicyclopentadiene-based resin and a preparation method thereof are provided. The preparation method of the modified dicyclopentadiene-based resin includes sequentially performing nitration reaction and hydrogenation reaction of a dicyclopentadiene phenolic resin to form a modified dicyclopentadiene-based resin for which the structure has at least two amino groups. The hydrogenation reaction is performed in a solvent at a temperature of 50° C. to 120° C.
    Type: Application
    Filed: December 16, 2022
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang
  • Publication number: 20240166859
    Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20240166866
    Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 ?m to 0.6 ?m. An average particle size of the second inorganic filler is 20 ?m to 50 ?m.
    Type: Application
    Filed: March 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166788
    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Yu-Ting Liu
  • Publication number: 20240166817
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 11, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240158632
    Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.
    Type: Application
    Filed: December 5, 2022
    Publication date: May 16, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20240162356
    Abstract: A light detecting device includes a substrate that has a lattice constant. A buffer layer is disposed on the substrate. A gradient layer is formed on the buffer layer opposite to the substrate, and includes a plurality of sublayers that have respectively lattice constants each of which is greater than the lattice constant of the substrate. The sublayers are arranged in a manner that the lattice constants of the sublayers undergo a gradual increase in lattice constant in a direction away from the substrate. A barrier layer is formed on the gradient layer opposite to the buffer layer, and has a lattice constant which is greater than that of the substrate and no smaller than the lattice constants of the sublayers. An absorption layer is formed on the barrier layer opposite to the gradient layer.
    Type: Application
    Filed: March 29, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Wen HUANG, Yung-Chao CHEN, Yi-Hsiang WANG, Wei LIN
  • Publication number: 20240152034
    Abstract: An optical element driving mechanism is provided, which includes a movable portion, a fixed portion and a driving assembly. The movable portion is connected with an optical element. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Inventors: Chen-Hung CHAO, Po-Xiang ZHUANG, Chao-Chang HU, Yi-Ho CHEN
  • Publication number: 20240152033
    Abstract: An optical system is provided, including a movable part, a fixed part, and a driving assembly. The movable part is connected to a first optical element. The movable part is movable relative to the fixed part. The fixed part has a fixed part opening, wherein a light passes through the fixed part opening. The driving assembly drives the movable part to move relative to the fixed part. The first optical element at least partially overlaps the fixed part opening when the movable part is in a first position. When the movable part is in an extreme position, the first optical element does not overlap the fixed part opening.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Inventors: Chen-Hung CHAO, Po-Xiang ZHUANG, Chao-Chang HU, Yi-Ho CHEN, Wei-Jhe SHEN
  • Publication number: 20240152035
    Abstract: An optical system is provided, including a fixed part, a movable part, and a driving assembly. The fixed part has an opening. A light passes through the opening. The movable part is movable relative to the fixed part and connected to a first optical element. The driving assembly drives the movable part to move relative to the fixed part. The first optical element at least partially overlaps the opening when the movable part is in a first position. The first optical element further includes a first optical element surface, and the first optical element surface faces the light.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Inventors: Chen-Hung CHAO, Po-Xiang ZHUANG, Chao-Chang HU, Yi-Ho CHEN, Wei-Jhe SHEN
  • Publication number: 20240150547
    Abstract: A composite material substrate includes an inorganic filler, a resin composition, and a dispersant. The resin composition includes a bismaleimide resin, a naphthalene ring-containing epoxy resin, and a benzoxazine resin. The inorganic filler, the resin composition, and the dispersant are mixed together.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 9, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240150568
    Abstract: The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 9, 2024
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Patent number: RE50000
    Abstract: A keyswitch structure includes a base, a keycap, a first support, a second support, and a connection structure. The keycap moves up and down relative to the base through the first support and the second support. The connection structure is disposed on the base and includes a vertical-motion limiting part and a horizontal-motion limiting part. The first support includes a rod-shaped connection portion and is connected to the connection structure through the rod-shaped connection portion. The vertical-motion limiting part prevents the rod-shaped connection portion from vertically moving. The horizontal-motion limiting part limits the horizontal movement of the rod-shaped connection portion. The vertical-motion limiting part and the horizontal-motion limiting part are separated in the rotation axis of the rod-shaped connection portion.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: June 4, 2024
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chih-Hao Chen, Chih-Hung Chen, Chin-Hung Lin, Ling-Hsi Chao, Chih-Chung Yen