Patents by Inventor HUNG-CHIEH CHIN

HUNG-CHIEH CHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11116082
    Abstract: An improved insulation protection structure comprises a sensor film, a chip outline, a protective film, and an insulating cement layer. The chip outline is on the sensor film, the protective film is on the chip outline, the insulating cement layer is between the chip outline and the protective film. The insulating cement layer comprises at least one surface facing inward the chip outline, retracted toward the direction of the chip outline and forms a retracted region along at least one side of the sensor film. Area of the proposed retracted region is preferably no more than 20% of that of the total insulating cement layer, and the conventional issues such as sulphide corrosion are solved. The proposed insulating cement layer can be cured merely at room temperature, and widely used for adhesive materials including both a gel and film, thus characterized by wider application range and better industrial applicability.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 7, 2021
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Hung-Chieh Chin, Po-Lin Chen, Hung Chien Lee, Feng Ju Li, Dong-Sheng Xie, Gang Wu
  • Publication number: 20210112665
    Abstract: An improved insulation protection structure comprises a sensor film, a chip outline, a protective film, and an insulating cement layer. The chip outline is on the sensor film, the protective film is on the chip outline, the insulating cement layer is between the chip outline and the protective film. The insulating cement layer comprises at least one surface facing inward the chip outline, retracted toward the direction of the chip outline and forms a retracted region along at least one side of the sensor film. Area of the proposed retracted region is preferably no more than 20% of that of the total insulating cement layer, and the conventional issues such as sulphide corrosion are solved. The proposed insulating cement layer can be cured merely at room temperature, and widely used for adhesive materials including both a gel and film, thus characterized by wider application range and better industrial applicability.
    Type: Application
    Filed: November 18, 2019
    Publication date: April 15, 2021
    Inventors: HUNG-CHIEH CHIN, PO-LIN CHEN, HUNG CHIEN LEE, FENG JU LI, DONG-SHENG XIE, GANG WU
  • Patent number: 10635252
    Abstract: A touch module includes a substrate and a touch electrode layer. The touch electrode layer is disposed on the substrate. The touch electrode layer includes a plurality of main mesh patterns and a plurality of dummy mesh patterns. The dummy mesh patterns of the touch electrode layer each have a plurality of breakpoints.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: April 28, 2020
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTEFACE SOLUTION LIMITED
    Inventors: Hung-Chieh Chin, Yueh-Feng Yang, Po-Lin Chen, Yen-Heng Huang, Ju-Xiang Liu
  • Publication number: 20190278406
    Abstract: A touch panel, comprising: a substrate; a plurality of sensing electrodes on the substrate, each of the plurality of sensing electrodes being formed by a plurality of metal meshes; and a plurality of traces on the substrate, the plurality of traces electrically coupled to the plurality of sensing electrodes, and each of the plurality of traces are a metal wire; wherein a blackening layer is formed on each of the plurality of sensing electrodes, and no blackening layer is formed on the plurality of traces. The blackening layers of the touch panel of the present invention only cover the sensing electrodes and do not cover the traces, which can avoid chemical substances remaining on the traces and traces being corroded and disconnection when the black layers are manufactured.
    Type: Application
    Filed: June 26, 2018
    Publication date: September 12, 2019
    Inventors: YUE-FENG YANG, YEN-HENG HUANG, PO-LIN CHEN, HUNG-CHIEH CHIN, JHE-WEI ZENG, JU-XIANG LIU