Patents by Inventor Hung-Chih Kuo

Hung-Chih Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11948904
    Abstract: A die includes a substrate, a conductive pad, a connector and a protection layer. The conductive pad is disposed over the substrate. The connector is disposed on the conductive pad. The connector includes a seed layer and a conductive post. The protection layer laterally covers the connector. Topmost surfaces of the seed layer and the conductive post and a top surface of the protection layer are level with each other.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11948863
    Abstract: A package structure and method of forming the same are provided. The package structure includes a polymer layer, a redistribution layer, a die, and an adhesion promoter layer. The redistribution layer is disposed over the polymer layer. The die is sandwiched between the polymer layer and the redistribution layer. The adhesion promoter layer, an oxide layer, a through via, and an encapsulant are sandwiched between the polymer layer and the redistribution layer. The encapsulant is laterally encapsulates the die. The through via extends through the encapsulant. The adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant. A bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen
  • Patent number: 11936238
    Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: March 19, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Chih Chen, Hung-Chieh Lin, Chao-Lung Kuo, Yi-Ping Hsieh, Chien-Shien Lee
  • Patent number: 11711074
    Abstract: An optical receiver device includes a boost converter circuit, an optical receiver circuit, and a pulse width modulation controller circuitry. The boost converter circuit is configured to convert a supply voltage according to a pulse width modulation signal, in order to generate an output voltage. The optical receiver circuit is configured to set a gain according to the output voltage, in order to convert an optical signal to a data signal according to the gain. The pulse width modulation controller circuitry is configured to perform a digital to analog conversion according to a control code to gradually adjust a current associated with the output voltage, and to compare the output voltage with a reference voltage to generate the pulse width modulation signal.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: July 25, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Shih-Cheng Wang, Hsin-Chuan Chen, Ko-Li Hung, Hung-Chih Kuo, Shih-Chieh Chen
  • Publication number: 20220237196
    Abstract: A data monitoring method for a standardized management system includes: obtaining log files of a standardized management system; parsing the log files to obtain parsed data, and saving the parsed data in a database; and displaying queried target data and historical data corresponding to the target data on a same interface according to a preset rule and the database.
    Type: Application
    Filed: September 8, 2021
    Publication date: July 28, 2022
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Wenjie WANG, Dandan CHEN, SHENG-HUA SU, HUNG-CHIH KUO
  • Patent number: 11357788
    Abstract: The present disclosure provides a method of reducing neurodegeneration and/or TDP43 associated aggregation, comprising knocking down the expression of Nuclear Paraspeckle Assembly Transcript 1 (NEAT1) or LncRNA NEAT1. Also provided are methods for screening a candidate agent that reduces neurodegeneration and/or TDP43 associated aggregation in a cell, treating or preventing a neurodegenerative disorder, delaying or preventing the onset of a neurodegenerative disorder or reducing a risk for developing a neurodegenerative disorder in a subject and determining whether a subject is suffering from, or at a risk of developing a neurodegenerative disorder, comprising measuring the presence of cytoplasmic NEAT1 in a biological sample, wherein the presence is indicative of the risk of developing a neurodegenerative disorder.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 14, 2022
    Assignee: ACADEMIA SINICA
    Inventors: Hung-Chih Kuo, Yi-Ying Wu
  • Patent number: 11339405
    Abstract: Disclosed herein are kits comprising transcription factors for inducing a fibroblast cell into an induced embryonic neural progenitor cell. The induced embryonic neural progenitor cell is then capable of differentiating into an astrocyte, an oligodendrocyte or a neuron. Also disclosed are the uses of the kit as a platform for selecting a drug candidate to treat neurological diseases.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: May 24, 2022
    Assignee: ACADEMIA SINICA
    Inventors: Hung-Chih Kuo, Ching-Yu Chuang, Chan-Hsien Yeh
  • Publication number: 20210391855
    Abstract: An optical receiver device includes a boost converter circuit, an optical receiver circuit, and a pulse width modulation controller circuitry. The boost converter circuit is configured to convert a supply voltage according to a pulse width modulation signal, in order to generate an output voltage. The optical receiver circuit is configured to set a gain according to the output voltage, in order to convert an optical signal to a data signal according to the gain. The pulse width modulation controller circuitry is configured to perform a digital to analog conversion according to a control code to gradually adjust a current associated with the output voltage, and to compare the output voltage with a reference voltage to generate the pulse width modulation signal.
    Type: Application
    Filed: March 16, 2021
    Publication date: December 16, 2021
    Inventors: SHIH-CHENG WANG, HSIN-CHUAN CHEN, KO-LI HUNG, HUNG-CHIH KUO, SHIH-CHIEH CHEN
  • Patent number: 10519019
    Abstract: A radiator funnel assembly facilitates filling refrigerant liquids in different radiators. The assembly provides various sizes and types of adapters and caps, with each adapter and cap having a unique identifier to facilitate assemblage and indicate a matching radiator fill opening. The assembly includes a funnel configured to receive a radiator fluid and carries the radiator fluid through a spout. Multiple conduits detachably attach in series to the spout. Multiple adapters receive the conduits and engage a specific radiator fill opening. Each adapter has a unique identifier that enables identification of the connecting conduit, and also identifies the specific type of radiator fill opening that is operable with the adapter. Multiple caps fasten the adapters to the radiator opening. Each cap has a unique identifier to identify and match to the appropriate adapter. This is useful for matching the adapter and cap to different types of radiators.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: December 31, 2019
    Inventor: Hung-Chih Kuo
  • Patent number: 10494143
    Abstract: A stackable and nestable food containment system provides temporary storage of edible substances. The system comprises tray members and lids that have an interengageable relationship. The tray member has a bottom surface with at least one first groove. The lid has at least one second groove that substantially matches the first groove. The grooves are aligned to enable arrangement of the tray members in a stacked configuration, while also restricting lateral slippage between tray members. When the tray members are covered with their correlating lids and in arranged in a stacked arrangement, spillage is also inhibited. Each tray has at least one barrier that forms three separate compartments. The compartments serve to segregate different edible substances, and also create an interlocking arrangement between tray members in a nested configuration. The tray members and the lids are fabricated from a material that is microwavable and dishwasher safe.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: December 3, 2019
    Inventors: Hung-Chih Kuo, Peiling Chang Chien
  • Publication number: 20190282605
    Abstract: The present disclosure provides a method of reducing neurodegeneration and/or TDP43 associated aggregation, comprising knocking down the expression of Nuclear Paraspeckle Assembly Transcript 1 (NEAT1) or LncRNA NEAT1. Also provided are methods for screening a candidate agent that reduces neurodegeneration and/or TDP43 associated aggregation in a cell, treating or preventing a neurodegenerative disorder, delaying or preventing the onset of a neurodegenerative disorder or reducing a risk for developing a neurodegenerative disorder in a subject and determining whether a subject is suffering from, or at a risk of developing a neurodegenerative disorder, comprising measuring the presence of cytoplasmic NEAT1 in a biological sample, wherein the presence is indicative of the risk of developing a neurodegenerative disorder.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 19, 2019
    Inventors: Hung-Chih Kuo, Yi-Ying Wu
  • Publication number: 20180299430
    Abstract: Disclosed herein are kits comprising transcription factors for inducing a fibroblast cell into an induced embryonic neural progenitor cell. The induced embryonic neural progenitor cell is then capable of differentiating into an astrocyte, an oligodendrocyte or a neuron. Also disclosed are the uses of the kit as a platform for selecting a drug candidate to treat neurological diseases.
    Type: Application
    Filed: April 11, 2018
    Publication date: October 18, 2018
    Applicant: Academia Sinica
    Inventors: Hung-Chih KUO, Ching-Yu CHUANG, Chan-Hsien YEH
  • Patent number: 10051979
    Abstract: A stackable can rack assembly provides a plurality of modular racks that facilitate both the loading of cans and the presentation of the cans for removal by a consumer. Multiple modular racks can be configured in a variety of stacked arrangement. A plurality of shelves are disposed at a slope to create a gravity fed arrangement to enable the cans to roll forward for dispensing. A pair of side panels support the shelves. The side panels comprise a top flat bar defined by a convex hump having a flat surface, and a bottom flat bar defined by a concave hump having a flat surface. The humps couple together and the flat surface enhance stability for stacking multiple modular racks. At least one bracket affixes to the bottom flat bar to fasten the top and bottom flat bars together. A back panel provide structural integrity to the modular racks.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: August 21, 2018
    Inventor: Hung-Chih Kuo
  • Publication number: 20180153303
    Abstract: A stackable can rack assembly provides a plurality of modular racks that facilitate both the loading of cans and the presentation of the cans for removal by a consumer. Multiple modular racks can be configured in a variety of stacked arrangement. A plurality of shelves are disposed at a slope to create a gravity fed arrangement to enable the cans to roll forward for dispensing. A pair of side panels support the shelves. The side panels comprise a top flat bar defined by a convex hump having a flat surface, and a bottom flat bar defined by a concave hump having a flat surface. The humps couple together and the flat surface enhance stability for stacking multiple modular racks. At least one bracket affixes to the bottom flat bar to fasten the top and bottom flat bars together. A back panel provide structural integrity to the modular racks.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Inventor: Hung-Chih Kuo
  • Publication number: 20180155175
    Abstract: A radiator funnel assembly facilitates filling refrigerant liquids in different radiators. The assembly provides various sizes and types of adapters and caps, with each adapter and cap having a unique identifier to facilitate assemblage and indicate a matching radiator fill opening. The assembly includes a funnel configured to receive a radiator fluid and carries the radiator fluid through a spout. Multiple conduits detachably attach in series to the spout. Multiple adapters receive the conduits and engage a specific radiator fill opening. Each adapter has a unique identifier that enables identification of the connecting conduit, and also identifies the specific type of radiator fill opening that is operable with the adapter. Multiple caps fasten the adapters to the radiator opening. Each cap has a unique identifier to identify and match to the appropriate adapter. This is useful for matching the adapter and cap to different types of radiators.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Inventor: Hung-Chih Kuo
  • Patent number: D266592
    Type: Grant
    Filed: May 19, 1980
    Date of Patent: October 19, 1982
    Assignee: E. F. Bavis & Associates, Inc.
    Inventor: Edward F. Bavis
  • Patent number: D830781
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 16, 2018
    Inventor: Hung-Chih Kuo
  • Patent number: D840716
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: February 19, 2019
    Inventor: Hung-Chih Kuo
  • Patent number: D880913
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 14, 2020
    Inventor: Hung-Chih Kuo
  • Patent number: D937519
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 30, 2021
    Inventors: Tsung-Yu Tsai, Hung-Chih Kuo