Abstract: An auxiliary power supply unit of a data center includes a thermoelectric chip module and a direct current/alternating current (DC/AC) voltage converter connected to the thermoelectric chip module. The thermoelectric chip module includes a number of thermoelectric chips. At least one sidewall of each thermoelectric chip contacts a hot pipe of the data center. The thermoelectric chips generate a direct current (DC) voltage when a temperature difference between the sidewalls of each thermoelectric chip exists. The DC/AC voltage converter converts the DC voltage into an alternating current (DC) voltage to power an air treatment device of the data center.

Abstract: A power supply system includes a number of aerogenerators, a number of rectifiers, and a direct current to direct current (DC/DC) converter. A first terminal of each rectifier is connected to a corresponding one of the aerogenerators. A first terminal of the DC/DC converter is connected to second terminals of the rectifiers. A second terminal of the DC/DC converter is connected to a power unit of a container data center. Each rectifier converts the alternating current (AC) generated by the corresponding aerogenerator to a pulsating direct current (DC). The DC/DC converter converts the pulsating DC to a constant voltage DC and supplies power to the power unit.

Abstract: An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms.

Abstract: A temperature and humidity control chamber includes a housing defining a receiving chamber, a support frame received in the receiving chamber, four elevating members supporting the support frame, four driving assemblies mounted on the housing, and a controller operable to control the driving assemblies. The four elevating members are capable of moving the support frame from a first vertical position to a second vertical position.

Abstract: A support mechanism includes a base, a first connection member connected to one side of the base, a rotation assembly connected to the other side of the base, and a second connection member rotatably connected to the rotation assembly. The rotation assembly includes a first hinged member and a second hinged member. The first hinged member includes a pivot shaft, and the second hinged member forms an engaging portion in which the pivot shaft is rotatably received. The first hinged member is rotatably connected to the base, and the second hinged member is rotatably connected with the second connection member. The disclosure further provides a display device using the support mechanism.

Abstract: An electronic device includes a computer server and an energy recycling system. The computer server includes a frame, at least one fan, and a heat source both are received in the frame. The frame includes a first sidewall with a plurality of vents formed thereon. The fan defines an air inlet facing the heat source, and an air outlet facing the first sidewall and substantially aligned with the vents. The energy recycling system includes a rotation assembly and an electric generator. The rotation assembly includes a rotation shaft and a plurality of driven members formed on the rotation shaft. The rotation assembly is arranged in front of the first sidewall. The driven members are driven by the airflow to rotate the rotation shaft. The rotation shaft is connected to the electric generator configured for converting the rotation of the rotation shaft into electrical energy.

Abstract: An exemplary receiving connector adapted for connecting to an insert connector to achieve electrical connection therebetween includes a main body, a first electrode, a second electrode, and an operating member. The first electrode and the second electrode are mounted to the main body. The operating member includes an operating pole mounted with the second electrode. The operating pole is capable of being manipulated by a user to drive the second electrode to move between a first position and a second position.

Abstract: A heat dissipation system dissipating heat from a server includes a plurality of fans mounted on a server by a fan holder. Each fan has an inlet and an outlet. The fan holder has a framework attached to one of outer sides of the server and accommodating the fans therein. The inlets or the outlets communicate with the server through the fan holder to enable the fans to generate airflow into or out of the server.

Abstract: An electronic device with a cooling system includes an enclosure. A first electronic component and a second electronic component in parallel are received in the enclosure. Air inlets are defined in a front board of the enclosure to receive cool air. A first flow of the cool air passes through a main airflow path to cool the first electronic component and the second electronic component. A second flow of the cool air passes through an auxiliary airflow path to cool the second electronic component. The main airflow path and the auxiliary airflow path are separated by a clapboard. The cool air heated by the first and second electronic components is then exhausted through the air outlets defined in a back board of the enclosure.

Abstract: A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.

Abstract: A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

Abstract: A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.

Abstract: A heatsink assembly having a stabilization plate is described. The stabilization plate, such as an n-shaped PORON slice, is disposed under a heatsink, and is surrounding a thermal pad under the heatsink. The stabilization plate is helpful to stabilize the combination of the thermal pad up to the heatsink. With the stabilization, the thermal pad is efficiently stuck on to a die for dissipating the heat therefrom.