Patents by Inventor Hung Hsiang Hsu
Hung Hsiang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12009033Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.Type: GrantFiled: June 20, 2023Date of Patent: June 11, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
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Publication number: 20240121373Abstract: Disclosed are an image display method and a 3d display system. The method is adapted to the 3d display system including a 3d display device and includes the following steps. A first image and a second image are obtained by splitting an input image according to a 3d image format. Whether the input image is a 3D format image complying with the 3D image format is determined through a stereo matching processing performed on the first image and the second image. An image interweaving process is enabled to be performed on the input image to generate an interweaving image in response to determining that the input image is the 3D format image complying with the 3D image format, and the interweaving image is displayed via the 3D display device.Type: ApplicationFiled: May 10, 2023Publication date: April 11, 2024Applicant: Acer IncorporatedInventors: Kai-Hsiang Lin, Hung-Chun Chou, Wen-Cheng Hsu, Shih-Hao Lin, Chih-Haw Tan
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11947173Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Publication number: 20240069277Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
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Patent number: 11020937Abstract: A pad comprises a first sheet, a second sheet and a cushion. The outer periphery of the second sheet is attached to the first sheet, making a closed accommodation space between the first sheet and the second sheet for being filled with cushions. The cushion comprises a plurality of cushions with various phases and those cushions contact each other, so that energy is absorbed during collision or impact by means of multiple cushions with various phases simultaneously.Type: GrantFiled: October 9, 2018Date of Patent: June 1, 2021Assignee: DEYORK LTD.Inventor: Hung Hsiang Hsu
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Publication number: 20190255800Abstract: The present invention discloses a cushioning sheet used for being mounted on clothes and comprises: a cushioning member, a first layer body and a second layer body; the cushioning member comprises a plurality of cushioning blocks which are spaced to form a plurality of slots therein, and the cushioning blocks jointly construct a first attaching portion and a second attaching portion respectively on opposite sides; a partial area of the first layer body adjacent to the first attaching portion forms a first joining section, and the remaining area extends out of the first joining section to form a first outer periphery; a partial area of the second layer body adjacent to the second attaching portion forms a second joining section, and the remaining area extends out of the second joining section to form a second outer periphery; and wherein, the cushioning blocks have different height.Type: ApplicationFiled: April 18, 2019Publication date: August 22, 2019Applicant: DEYORK LTD.Inventor: Hung Hsiang HSU
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Publication number: 20190255808Abstract: The present invention discloses a pad comprising a first sheet, a second sheet and a cushion. The outer periphery of the second sheet is attached to the first sheet, further making a closed accommodation space between the first sheet and the second sheet for being filled with cushions. The cushion comprises a plurality of cushions with various phases and those cushions contact with each other, so that energy is absorbed during collision or impact by means of multiple cushions with various phases simultaneously. And then, a human body is protected and an object avoids crashin.Type: ApplicationFiled: October 9, 2018Publication date: August 22, 2019Applicant: DEYORK LTD.Inventor: HUNG HSIANG HSU
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Patent number: 8316362Abstract: A method for updating a program section is disclosed; the method is used for an electronic system. The electronic system comprises a control unit and a storage device; the control unit is electrically connected with the storage device; the storage device comprises a program section; the program section comprises an application section and a boot section; the application section comprises a first bootloader and application information, wherein the first bootloader comprises a first driver. The method comprises the following steps of: connecting a data source device, wherein the data source device comprises update data; determining whether the first driver is able to drive the data source device or not; and if the first driver is able to drive the data source device, the first driver performs an updating procedure according to the update data.Type: GrantFiled: June 8, 2010Date of Patent: November 20, 2012Assignee: Wistron Neweb Corp.Inventors: Chih-Hung Pan, Hung-Hsiang Hsu, Shih-Chieh Tzeng
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Publication number: 20110010510Abstract: A method for updating a program section is disclosed; the method is used for an electronic system. The electronic system comprises a control unit and a storage device; the control unit is electrically connected with the storage device; the storage device comprises a program section; the program section comprises an application section and a boot section; the application section comprises a first bootloader and application information, wherein the first bootloader comprises a first driver. The method comprises the following steps of: connecting a data source device, wherein the data source device comprises update data; determining whether the first driver is able to drive the data source device or not; and if the first driver is able to drive the data source device, the first driver performs an updating procedure according to the update data.Type: ApplicationFiled: June 8, 2010Publication date: January 13, 2011Applicant: WISTRON NEWEB CORP.Inventors: Chih-Hung Pan, Hung-Hsiang Hsu, Shih-Chieh Tzeng
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Patent number: 7580419Abstract: A network system integrated with SIP call server and SIP agent client. The network system is provided between a local device and a network for connecting with at least one remote device. The network system includes: at least one local connecting port for coupling with the local device; a remote connecting port for coupling with the network; and an SIP processing module for executing at least one SIP call server program and SIP agent client program. After the local and remote devices perform SIP registry on the SIP call server program, the local and remote devices can telecommunicate with each other by voice from a private SIP telecommunication network. The network system further includes an IP phone connecting port for coupling with at least one IP phone and a voice processing module for converting the voice signal of the IP phone into digital signal and converting the digital signal of the SIP processing module into voice signal.Type: GrantFiled: February 17, 2004Date of Patent: August 25, 2009Assignee: Zyxel Communications CorpInventor: Hung Hsiang Hsu