Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Abstract: Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.

Abstract: Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.

Abstract: A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.

Abstract: A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.

Abstract: A method of fabricating polysilicon patterns. The method includes depositing polysilicon on a substrate. The polysilicon may be doped or pre-doped depending upon the application. A mask layer is applied and patterned. Thereafter, the polysilicon is etched to form the polysilicon patterns and an oxidizing step is performed. The mask layer is removed after the oxidizing step is performed.

Abstract: A method of fabricating polysilicon patterns. The method includes depositing polysilicon on a substrate. The polysilicon may be doped or pre-doped depending upon the application. A mask layer is applied and patterned. Thereafter, the polysilicon is etched to form the polysilicon patterns and an oxidizing step is performed. The mask layer is removed after the oxidizing step is performed.

Abstract: Methods and systems are described for determining floating body delay effects in an SOI wafer, wherein test apparatus is provided in a wafer comprising a plurality of floating body devices fabricated in series in the wafer, and a pulse generation circuit providing a pulse output corresponding to a delay time associated with the floating body chain according to an input pulse edge and a propagated pulse edge from the floating body devices.

Abstract: Methods are described for characterizing floating body delay effects in SOI wafers comprising providing a pulse edge to a floating body and a tied body chain in the wafer, storing tied body chain data according to one or more of the floating body devices, and characterizing the floating body delay effects according to the stored tied body chain data. Test apparatus are also described comprising a floating body chain including a plurality of series connected floating body inverters or NAND gates fabricated in the wafer and a tied body chain comprising a plurality of series connected tied body devices to in the wafer. Storage devices are coupled with the tied body devices and with one or more of the floating body devices and operate to store tied body chain data from the tied body devices according to one or more signals from floating body chain.

Abstract: A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.