Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.

Abstract: A heat dissipation assembly and an electronic assembly, wherein the heat dissipation assembly includes condensers and fan, the condensers each include first chamber body, second chamber body, and pipes. Two opposite ends of each pipe are respectively in fluid communication with the first and second chamber bodies, every two of the pipes located adjacent to each other define a heat dissipation gap therebetween. The first and second chamber bodies and the pipes together define a heat dissipation channel which is in air communication with the heat dissipation gaps. The fan is disposed on the condensers and in air communication with the heat dissipation channel and configured to guide an airflow flowing through the heat dissipation channel and the heat dissipation gaps so as to cool the working fluid flowing through the pipes.

Abstract: A heat dissipation system and an electronic device. The heat dissipation system configured to circulate working fluid and to cool heat source. Heat dissipation system includes casing, first tube, second tube, condenser and flow rate controller. Partition is fixed in the base and is located in the accommodation space to divide the accommodation space into a first and a second accommodation space. The first accommodation space is located above the second accommodation space along a gravitational direction. The inlet is in fluid communication with the first accommodation space. The outlet is in fluid communication with the second accommodation space. The partition includes a plurality of drip holes. The first and the second accommodation spaces are in fluid communication with each other via the drip holes. The working fluid is configured to drip onto the heat source via the plurality of drip holes.

Abstract: A condenser includes a casing and pipes. The casing includes an inlet chamber, an outlet chamber, a first inlet, a first outlet, an accommodation space, a second inlet, and a second outlet. The first inlet and the first outlet are respectively in fluid communication with the inlet chamber and the outlet chamber. The accommodation space accommodates a coolant, and the second inlet and the second outlet are in fluid communication with the accommodation space not in fluid communication with the inlet chamber and the outlet chamber. The pipes are in the accommodation space and connect the inlet chamber with the outlet chamber, and a working fluid flows from the inlet chamber to the outlet chamber via the pipes. The first inlet is located closer to the second outlet than the first outlet, and the first outlet is located closer to the second inlet than the first inlet.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

Abstract: A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.

Abstract: A gas storage device includes a casing, a lift platform, a lift mechanism, a driving mechanism, an exhaust valve and a gas joint. The lift platform is movably disposed in the casing, wherein a gas storage space is between a bottom of the casing and the lift platform. The lift mechanism is disposed in the casing and connected to the lift platform. The driving mechanism is connected to the lift mechanism. The driving mechanism drives the lift mechanism to drive the lift platform to move. The exhaust valve is connected to the lift platform and communicates with the gas storage space. The gas joint is connected to the bottom of the casing and communicates with the gas storage space.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

Abstract: An immersion cooling system configured to store a coolant configured for cooling a heat source and including a liquid container, a tube and a gas regulating assembly. The liquid container is configured to store the coolant configured to cool the heat source. One end of the tube is connected to the liquid container. The gas regulating assembly is located above the tube and includes a valve, a cooler, and a gas container. The valve includes a first pipe, a second pipe and a third pipe. The valve is switchable to connect the first pipe to the second pipe or connect the first pipe to the third pipe. The first pipe of the valve is connected to the tube via the cooler. The second pipe is connected to ambient air, and the third pipe is connected to the gas container.

Abstract: A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve section, an input portion, and an output portion. The sleeve section sleeved with a part of the first pipeline to form a circulation tunnel between the sleeve section and the part of the first pipeline. The input portion and the output portion are connected to two ends of the sleeve section respectively.

Abstract: A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve portion. The sleeve portion is sleeved with a part of the first pipeline to form a circulation tunnel therebetween. One of the sleeve portions and the part of the first pipeline has a first surface and a second surface. The first surface contacts the first fluid. The second surface contacts the second fluid. The second surface has a plurality of protruding strips.

Abstract: A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.

Abstract: A cooling system of server includes a tank and a pressure control device. The tank is configured to accommodate a dielectric fluid. The pressure control device is configured to regulate the pressure of the tank. The pressure control device includes a condenser, a dehumidifier, a gas storage chamber, and a valve. The condenser is connected to the tank. The dehumidifier is connected to the condenser. The gas storage chamber is connected to the dehumidifier. The valve is connected between the dehumidifier and the gas storage chamber. The valve is configured to communicate and not to communicate the dehumidifier and the gas storage chamber.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

Abstract: The invention provides a heat sink. The heat sink is configured to be in thermal contact with a heat source. The heat sink includes a base portion, a plurality of fin portions, and a wall portion. The base portion includes a thermal contact surface and a rear surface. The thermal contact surface is configured to be in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface. The fin portions protrude from the rear surface of the base portion. The wall portion protrudes from the rear surface of the base portion and surrounds the fin portions. In addition, the invention also provides an electronic assembly including the heat sink.

Abstract: The invention provides a cooling system for a server. The cooling system includes a casing and a first heat dissipation device. The casing includes a tank and a cover. The tank has an accommodation space. The cover is movably mounted on the tank, and the cover covers the accommodation space so as to form an airtight space with the tank. The first heat dissipation device is mounted on the cover and located within the airtight space of the casing.