Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

Abstract: The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.

Abstract: A composite material substrate includes an inorganic filler, a resin composition, and a dispersant. The resin composition includes a bismaleimide resin, a naphthalene ring-containing epoxy resin, and a benzoxazine resin. The inorganic filler, the resin composition, and the dispersant are mixed together.

Abstract: An information handling system includes a memory and a processor. The memory stores a current basic input/output system (BIOS) firmware image. During a regular boot mode of the information handling, the processor creates a first set of tables associated with the current BIOS firmware image, stores the first tables to the memory, and receives a BIOS firmware update image. During a BIOS update boot mode of the information handling system, the processor creates a second plurality of tables associated with the BIOS firmware update image, and compares the first and second tables. In response to a difference being determined between the first and second tables, the processor aborts the BIOS update boot mode and generate an error log.

Abstract: A resin composition includes resin and inorganic filler. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. Compared to a total of 100 parts by mass of the resin, the usage amount of the inorganic filler is at least greater than or equal to 40 parts by mass.

Abstract: A powder composition includes a first powder, a second powder, and a modified functional group. A particle size range of the first powder is between 1 micron and 100 microns. The second powder and the modified functional group are modified on the first powder. A particle size range of the second powder is between 10 nanometers and 1 micron. A manufacturing method of a powder composition is also provided.

Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

Abstract: Provided herein are methods, systems, kits, and compositions useful for determining small molecule-protein interactions and protein-protein interactions. The photo-click tags provided herein can be conjugated to a small molecule or amino acid analog to provide compounds that can be integrated into a protein through photo-conjugation, allowing for identification of a small molecule-protein interaction or protein-protein interaction to elucidate the small molecules mechanism of action or the protein targeted by the small molecule. In some embodiments, the photo-click tags comprise a photo-conjugation moiety and a click chemistry handle, allowing for the attachment of various functional groups (e.g., affinity tags) to the small molecule or amino acid analog.

Abstract: A network accessing method includes performing a cell search procedure for a first RAT; receiving first SI from a first cell of the first RAT when the first cell has been found in the cell search procedure; determining whether second SI is scheduled by the first cell according to content of the first SI; receiving the second SI in response to determination of the second SI being scheduled and deriving information regarding a second cell of a second RAT different from the first RAT; searching for the second cell according to the information regarding the second cell; and attempting to access the second cell instead of the first cell when the second cell has been found. The first cell is configured to provide access to a first core network and the second cell is configured to provide access to a second core network different from the first core network.

Abstract: An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.

Abstract: A network accessing method includes performing a cell search procedure for a first RAT; receiving first SI from a first cell of the first RAT when the first cell has been found in the cell search procedure; determining whether second SI is scheduled by the first cell according to content of the first SI; receiving the second SI in response to determination of the second SI being scheduled and deriving information regarding a second cell of a second RAT different from the first RAT; searching for the second cell according to the information regarding the second cell; and attempting to access the second cell instead of the first cell when the second cell has been found. The first cell is configured to provide access to a first core network and the second cell is configured to provide access to a second core network different from the first core network.

Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.

Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.

Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.

Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.

Abstract: An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.

Abstract: An interface system for functional module and a functional module thereof are provided. The interface system for the functional module includes a main system and a plurality of functional modules. The main system has a mother board. Each of the functional modules has a circuit board, and at least one functional element disposed on the circuit board, and the functional element is an element having various functions and specifications. An expansion assembly is disposed between the mother board of the main system and the circuit board of any of the functional modules, and the expansion assembly is also disposed between the circuit boards of the functional modules. The main system is selectively and electrically connected to the functional modules through each of the expansion assemblies to be connected extendedly.

Abstract: An interface system for functional module and a functional module thereof are provided. The interface system for the functional module includes a main system and a plurality of functional modules. The main system has a mother board. Each of the functional modules has a circuit board, and at least one functional element disposed on the circuit board, and the functional element is an element having various functions and specifications. An expansion assembly is disposed between the mother board of the main system and the circuit board of any of the functional modules, and the expansion assembly is also disposed between the circuit boards of the functional modules. The main system is selectively and electrically connected to the functional modules through each of the expansion assemblies to be connected extendedly.

Abstract: A battery management system for a main system of an electronic device is provided. The battery management system is electrically connected with plural battery units. The battery management system includes plural insertion slots and a battery detachment protection device. The insertion slots electrically connected with the main system. The plural battery units are docked with the corresponding insertion slots. The battery detachment protection device is electrically connected with the main system. When an external force is applied to the battery detachment protection device, the battery detachment protection device generates a system protection sensing signal. In response to the system protection sensing signal, a power supply condition of at least one battery unit in the corresponding insertion slot is adjusted, and the at least one battery unit in the corresponding insertion slot is permitted to be detached from the corresponding insertion slot or positioned in the corresponding insertion slot.

Abstract: A battery management system for a main system of an electronic device is provided. The battery management system is electrically connected with plural battery units. The battery management system includes plural insertion slots and a battery detachment protection device. The insertion slots electrically connected with the main system. The plural battery units are docked with the corresponding insertion slots. The battery detachment protection device is electrically connected with the main system. When an external force is applied to the battery detachment protection device, the battery detachment protection device generates a system protection sensing signal. In response to the system protection sensing signal, a power supply condition of at least one battery unit in the corresponding insertion slot is adjusted, and the at least one battery unit in the corresponding insertion slot is permitted to be detached from the corresponding insertion slot or positioned in the corresponding insertion slot.