Patents by Inventor Hung-Lin Liao

Hung-Lin Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166874
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166817
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 11, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166844
    Abstract: A resin composition and use thereof, wherein the resin composition includes a resin base, an inorganic filler and a siloxane coupling agent. The resin base includes bismaleimide resins, benzoxazine resins, and naphthenic epoxy resins, and the inorganic filler includes strontium titanate or calcium-doped strontium titanate.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166859
    Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20240166866
    Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 ?m to 0.6 ?m. An average particle size of the second inorganic filler is 20 ?m to 50 ?m.
    Type: Application
    Filed: March 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Patent number: 11989046
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • Publication number: 20240158632
    Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.
    Type: Application
    Filed: December 5, 2022
    Publication date: May 16, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20240150547
    Abstract: A composite material substrate includes an inorganic filler, a resin composition, and a dispersant. The resin composition includes a bismaleimide resin, a naphthalene ring-containing epoxy resin, and a benzoxazine resin. The inorganic filler, the resin composition, and the dispersant are mixed together.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 9, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240150568
    Abstract: The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 9, 2024
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240124689
    Abstract: A resin composition includes resin and inorganic filler. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. Compared to a total of 100 parts by mass of the resin, the usage amount of the inorganic filler is at least greater than or equal to 40 parts by mass.
    Type: Application
    Filed: November 14, 2022
    Publication date: April 18, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20240101485
    Abstract: A powder composition includes a first powder, a second powder, and a modified functional group. A particle size range of the first powder is between 1 micron and 100 microns. The second powder and the modified functional group are modified on the first powder. A particle size range of the second powder is between 10 nanometers and 1 micron. A manufacturing method of a powder composition is also provided.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 28, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu
  • Patent number: 11920036
    Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 5, 2024
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chien-Kai Wei, Chia-Lin Liu
  • Patent number: 9470016
    Abstract: The present invention relates to a lock and a key for the same, and multiple modular lock core units are mounted in the lock. Multiple lock bead units having specific standard are mounted in each lock core unit. Each lock bead unit is detachable and is able to rearrange the permutations of the lock bead units. The key includes a handle, a core bar and multiple unlocking blocks. The core bar is connected with the handle. The unlocking blocks are detachable, are mounted around the core bar and have multiple lock teeth sequentially formed around the inner peripheries of the unlocking blocks. A user can adjust the permutations of the key teeth of the key to unlock the lock that has different permutations of the lock bead units, also can change the permutations of the lock core units to get the same effects.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: October 18, 2016
    Assignee: BLOFTOWN CO., LTD.
    Inventor: Hung-Lin Liao
  • Patent number: 9359792
    Abstract: A combination of a lock and a key includes a cylinder having a housing, multiple index rings and multiple cores. The housing has slot laterally defined through the wall thereof the housing. At least one first post and at least one second post respectively extend radially from the first end and the second end of the housing. The index rings are located in the housing and each have at least one column with a first mark. At least one cap restricts the index rings to the housing. Each index ring has one core received therein. The key has a handle, a shaft and multiple unlocking members mounted to the shaft. Each unlocking members has a second mark and a top portion. The index rings are removed and re-arranged by removing the cap via the slot so as to obtain different combinations by the first and second marks.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: June 7, 2016
    Assignee: Bloftown Co., Ltd.
    Inventor: Hung-Lin Liao
  • Publication number: 20150114056
    Abstract: The present invention relates to a lock and a key for the same, and multiple modular lock core units are mounted in the lock. Multiple lock bead units having specific standard are mounted in each lock core unit. Each lock bead unit is detachable and is able to rearrange the permutations of the lock bead units. The key includes a handle, a core bar and multiple unlocking blocks. The core bar is connected with the handle. The unlocking blocks are detachable, are mounted around the core bar and have multiple lock teeth sequentially formed around the inner peripheries of the unlocking blocks. A user can adjust the permutations of the key teeth of the key to unlock the lock that has different permutations of the lock bead units, also can change the permutations of the lock core units to get the same effects.
    Type: Application
    Filed: May 23, 2013
    Publication date: April 30, 2015
    Applicant: BLOFTOWN CO., LTD.
    Inventor: Hung-Lin Liao
  • Patent number: 8272242
    Abstract: A mechanical-combination door lock has a housing assembly, a lever assembly, a disable mechanism and a combination mechanism. The housing assembly is adapted to securely mount on a door. The lever assembly is mounted though the housing assembly and has a lock body, a lock bolt, an outer lever, an inner lever, a lock core, a lock rod and a linking gear wheel. The disable mechanism is mounted in the housing assembly above the lever assembly and has a retaining ring, a resetting resilient element and a turning rod. The combination mechanism is mounted in the housing assembly and has a pintle, multiple sleeves and multiple wheels. The mechanical-combination door lock has mechanical-combination detection and resetting functions and is allowed to be temporarily disabled while the door is open.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: September 25, 2012
    Inventors: Miko Lee, Hung-Lin Liao