Abstract: A three-dimensional measuring device includes a ball-shaped structure, an X-axis measuring module, a Y-axis measuring module and a Z-axis measuring module. The ball-shaped structure is moved and/or rotated in response to a movement of a movable object. The X-axis measuring module includes a first measuring structure and a first position sensor. The first measuring structure is movable along an X-axis direction and contacted with the ball-shaped structure. The Y-axis measuring module includes a second measuring structure and a second position sensor. The second measuring structure is movable along a Y-axis direction and contacted with the ball-shaped structure. The Z-axis measuring module includes a third measuring structure and a third position sensor. The third measuring structure is movable along a Z-axis direction and contacted with the ball-shaped structure.

Abstract: A vacuum battery structural assembly and a vacuum multi-cell battery module composed thereof are provided and include a first repeating unit including a first frame plate and a second frame plate with respect to the first frame plate; and an electrolyte channel defined within the first frame plate and the second frame plate to accommodate a liquid electrolyte, wherein both a surface of the first frame plate and a surface of the second frame plate include a vacuum suction area, the vacuum suction area includes a vacuum aperture and a vacuum channel, wherein the vacuum aperture is formed on at least one surface of the first frame plate and the second frame plate, the vacuum channel is positioned inside the first frame plate and the second frame plate, and is configured to generate a longitudinal pressing suction force and seal the first frame plate and the second frame plate.

Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A heterogeneous memory system is implemented using a low-latency near memory (NM) and a high-latency far memory (FM). Pages in the memory system include NM blocks stored in the NM and FM blocks stored in the FM. A page is assigned to a region in the memory system based on the proportion of NM blocks in the page. When accessing a block, the block address is used to determine a region of the memory system, and a block offset is used to determine whether the block is stored in NM or FM. The memory system may observe memory accesses to determine the access statistics of the page and the block. Based on a page's hotness and access density, the page may be migrated to a different region. Based on a block's hotness, the block may be migrated between NM and FM allocated to the page.

Abstract: The sound absorbing board includes a body and multiple sound absorbing elements. The body has a first side surface and a second side surface. The multiple sound absorbing elements are formed on the body at spaced intervals, and each one of the multiple sound absorbing elements has a protrusion, a groove, and two sound absorbing openings. The protrusion is formed on the first side surface of the body. The groove is formed on the second side surface of the body and has multiple concave portions and at least one convex portion. The multiple concave portions are formed on a bottom surface of the groove. The at least one convex portion is formed on the bottom surface of the groove, and is formed between two adjacent ones of the multiple concave portions. The two sound absorbing openings are formed on the two opposite side surfaces of the protrusion, respectively.

Abstract: A heterogeneous memory system is implemented using a low-latency near memory (NM) and a high-latency far memory (FM). Pages in the memory system include NM blocks stored in the NM and FM blocks stored in the FM. A page is assigned to a region in the memory system based on the proportion of NM blocks in the page. When accessing a block, the block address is used to determine a region of the memory system, and a block offset is used to determine whether the block is stored in NM or FM. The memory system may observe memory accesses to determine the access statistics of the page and the block. Based on a page's hotness and access density, the page may be migrated to a different region. Based on a block's hotness, the block may be migrated between NM and FM allocated to the page.

Abstract: A heterogeneous memory system is implemented using a low-latency near memory (NM) and a high-latency far memory (FM). Pages in the memory system include NM blocks stored in the NM and FM blocks stored in the FM. A page is assigned to a region in the memory system based on the proportion of NM blocks in the page. When accessing a block, the block address is used to determine a region of the memory system, and a block offset is used to determine whether the block is stored in NM or FM. The memory system may observe memory accesses to determine the access statistics of the page and the block. Based on a page's hotness and access density, the page may be migrated to a different region. Based on a block's hotness, the block may be migrated between NM and FM allocated to the page.

Abstract: The sound absorbing board includes a body and multiple sound absorbing elements. The body has a first side surface and a second side surface. The multiple sound absorbing elements are formed on the body at spaced intervals, and each one of the multiple sound absorbing elements has a protrusion, a groove, and two sound absorbing openings. The protrusion is formed on the first side surface of the body. The groove is formed on the second side surface of the body and has multiple concave portions and at least one convex portion. The multiple concave portions are formed on a bottom surface of the groove. The at least one convex portion is formed on the bottom surface of the groove, and is formed between two adjacent ones of the multiple concave portions. The two sound absorbing openings are formed on the two opposite side surfaces of the protrusion, respectively.

Abstract: A heterogeneous memory system is implemented using a low-latency near memory (NM) and a high-latency far memory (FM). Pages in the memory system include NM blocks stored in the NM and FM blocks stored in the FM. A page is assigned to a region in the memory system based on the proportion of NM blocks in the page. When accessing a block, the block address is used to determine a region of the memory system, and a block offset is used to determine whether the block is stored in NM or FM. The memory system may observe memory accesses to determine the access statistics of the page and the block. Based on a page's hotness and access density, the page may be migrated to a different region. Based on a block's hotness, the block may be migrated between NM and FM allocated to the page.

Abstract: A method for operating a printer to print with the operation having a pre-determined period of time between the start of a printing process and the completion of a fuser module heating process is provided. The method includes performing the heating process by heating the fuser module towards a target temperature. Next, compare the rest of the expected period of time for the fuser to arrive at the target temperature with the pre-determined period of time. If the expected period of time is no more than the predetermined period of time, start the printing processes. Lastly fuse the printing medium after the completion of the printing processes. The present invention also includes a method for operating a printer to print with the operation having an adjustable period of time between the start of the printing processes and the completion of a fuser module heating process.

Abstract: An apparatus and method for shifting the image-forming region of a printing device is disclosed. The apparatus includes a photoconductor, an encoder, several rollers, and a controlled device. The present invention is used to shift the image-forming region in the photoconductor by the controlled device. The damage of the image-forming region in the photoconductor can be reduced. The lifetime of the photoconductor can be extended. In addition, the controlled device uses firmware to shift the image-forming region. The shifting method can be a sequential mode or random mode.

Abstract: A screwdriver includes a handle and a plastic gear mechanism which drives a bit engaging device by a power source connected to the handle. A positive plate and a negative plate are respectively connected to the handle. A light frame has at least one light bulb connected thereto and a positive ring and a negative ring are respectively engaged with the light frame. A spring is mounted to the bit engaging device and connected between the negative ring and the negative plate. The at least one light bulb is connected to the positive ring and the negative ring. A gap is defined between the positive plate and an extension of the positive ring. An annular switch is rotatably mounted to the light frame and includes a touch piece which contacts both of the position plate and the extension of the positive ring to light the at least one light bulb.

Abstract: A screwdriver includes a handle and a plastic gear mechanism which drives a bit engaging device by a power source connected to the handle. A positive plate and a negative plate are respectively connected to the handle. A light frame has at least one light bulb connected thereto and a positive ring and a negative ring are respectively engaged with the light frame. A spring is mounted to the bit engaging device and connected between the negative ring and the negative plate. The at least one light bulb is connected to the positive ring and the negative ring. A gap is defined between the positive plate and an extension of the positive ring. An annular switch is rotatably mounted to the light frame and includes a touch piece which contacts both of the position plate and the extension of the positive ring to light the at least one light bulb.

Abstract: A power tool includes a function control mechanism to control operation of a drive spindle in a selected one of a rotary drive mode and a hammering mode. The function control mechanism includes a first ratchet that is mounted to rotate with the drive spindle, a second ratchet that is slidable from a first position to a second position, and a ring controller. The second ratchet is disengaged from the first ratchet when the second ratchet is in the first position, and is engaged with the first ratchet when the second ratchet is in the second position. The ring controller is coupled to a push ring that abuts against the second ratchet such that rotation of the ring controller results in movement of the second ratchet between the first and second positions.