Patents by Inventor Hung-Sheng Liu

Hung-Sheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009033
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Patent number: 11996866
    Abstract: A feedback control system configured to drive a load is disclosed. The feedback control system includes an up-sampling circuit, configured to perform an un-sampling operation on a source signal and produce an up-sampled signal with an up-sampling frequency according to the up-sampled signal and a feedback signal from the load; a delta circuit, coupled to the up-sampling circuit and configured to produce a delta signal; a sigma circuit, configured to produce a density modulation signal according to the delta signal; and a driving device, configured to drive the load according to the density modulation signal with the up-sampling frequency.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: May 28, 2024
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Hsi-Sheng Chen, Chieh-Yao Chang, Hung-Chi Huang, Jing-Meng Liu
  • Patent number: 11995263
    Abstract: A touch screen may be formed from a display and perimeter touch electrodes. Touches detected at one or more of the perimeter touch electrodes can be imputed to touch on a region of the display of the touch screen adjacent to the perimeter touch electrodes. In some examples, the perimeter touch electrodes comprise segmented frit metal arranged around the perimeter of the display (e.g., frit metal used to encapsulate the display). In some examples, the perimeter touch electrodes can be coupled to one or more touch sensing circuits via switching circuitry. In some examples, the switching circuitry can be operated based on control signals shared with the display circuitry.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: May 28, 2024
    Assignee: Apple Inc.
    Inventors: Hung Sheng Lin, Jun Qi, Hao-Lin Chiu, Sai-Chang Liu
  • Patent number: 11955554
    Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
  • Patent number: 11934480
    Abstract: A circuit for in-memory multiply-and-accumulate functions includes a plurality of NAND blocks. A NAND block includes an array of NAND strings, including B columns and S rows, and L levels of memory cells. W word lines are coupled to (B*S) memory cells in respective levels in the L levels. A source line is coupled to the (B*S) NAND strings in the block. String select line drivers supply voltages to connect NAND strings on multiple string select lines to corresponding bit lines simultaneously. Word line drivers are coupled to apply word line voltages to a word line or word lines in a selected level. A plurality of bit line drivers apply input data to the B bit lines simultaneously. A current sensing circuit is coupled to the source line.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: March 19, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Hang-Ting Lue, Hung-Sheng Chang, Yi-Ching Liu
  • Publication number: 20240088246
    Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Ling Hsu, Ping-Cheng Li, Hung-Ling Shih, Po-Wei Liu, Wen-Tuo Huang, Yong-Shiuan Tsair, Chia-Sheng Lin, Shih Kuang Yang
  • Patent number: 7503746
    Abstract: A fan of a heat sink comprising a hub, a plurality of ribs and a set of blades is provided. A distal end of the ribs is connected to circular sidewall of the hub and the set of blades are connected to the primal end of the ribs. The set of blades comprises an outer ring, multiple first blades, a guiding ring connected to the inner side of the first blades and multiple second blades positioned at the inner side of the first blades extending upwards from the top side of the guiding ring. The primal end of the ribs is connected to the guiding ring having an inclined slope extending from the hub towards the outer ring. The first and the second blades are adopted for increasing the air flow area, and thereby increase the air volume and air pressure and the inclined slope of the guiding ring is adopted to smoothly change the flow direction of the sucked air and thereby reduce the resistance to the air flow.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: March 17, 2009
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hung-Sheng Liu, Ya-Yu Cao
  • Publication number: 20070253813
    Abstract: A fan of a heat sink comprising a hub, a plurality of ribs and a set of blades is provided. A distal end of the ribs is connected to circular sidewall of the hub and the set of blades are connected to the primal end of the ribs. The set of blades comprises an outer ring, multiple first blades, a guiding ring connected to the inner side of the first blades and multiple second blades positioned at the inner side of the first blades extending upwards from the top side of the guiding ring. The primal end of the ribs is connected to the guiding ring having an inclined slope extending from the hub towards the outer ring. The first and the second blades are adopted for increasing the air flow area, and thereby increase the air volume and air pressure and the inclined slope of the guiding ring is adopted to smoothly change the flow direction of the sucked air and thereby reduce the resistance to the air flow.
    Type: Application
    Filed: May 1, 2006
    Publication date: November 1, 2007
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hung-Sheng Liu, Ya-Yu Cao
  • Publication number: 20070253161
    Abstract: A heat sink comprising an open frame including air inlets on a top side and a rotatable fan having a plurality of blades is provided. The heat sink is installed in the frame. The frame has pluralities of supporting elements and ribs positioned between two adjacent supporting elements. The supporting elements and ribs correspond to each other to form multiple side air inlets. The operation of the fan is capable of drawing a large volume of the air into the open frame via the top side and side air inlets. The flange of the blades is parallel to the inner curved side of the ribs when the blades pass by the ribs so that a large volume of air is guided into the frame to enhance the heat dissipation effect. This may also maintain an optimum static pressure and substantially reduce the noise level during the operation of the fan.
    Type: Application
    Filed: May 1, 2006
    Publication date: November 1, 2007
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hung-Sheng Liu, Jui-Hung Cheng, Yi-Chieh Chen
  • Patent number: 7061758
    Abstract: A fan impeller of a heat-dissipating fan device is mounted in a receiving space of a fan housing, and includes coupling ribs that extend radially and outwardly from an outer surrounding surface of a hub cap and that are spaced apart angularly from each other, a smaller-diameter first connecting ring disposed coaxially around an intermediate portion of the hub cap and connected to the coupling ribs, a larger-diameter second connecting ring disposed coaxially around a lower portion of the hub cap, and fan blades that are spaced apart angularly from each other. Each fan blade has a first blade body connected to and disposed uprightly on the first connecting ring, and a second blade body connected to and extending radially from the first blade body and having a bottom end connected to the second connecting ring.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: June 13, 2006
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hung-Sheng Liu, Ya-Yu Chao
  • Publication number: 20050122695
    Abstract: A fan impeller of a heat-dissipating fan device is mounted in a receiving space of a fan housing, and includes coupling ribs that extend radially and outwardly from an outer surrounding surface of a hub cap and that are spaced apart angularly from each other, a smaller-diameter first connecting ring disposed coaxially around an intermediate portion of the hub cap and connected to the coupling ribs, a larger-diameter second connecting ring disposed coaxially around a lower portion of the hub cap, and fan blades that are spaced apart angularly from each other. Each fan blade has a first blade body connected to and disposed uprightly on the first connecting ring, and a second blade body connected to and extending radially from the first blade body and having a bottom end connected to the second connecting ring.
    Type: Application
    Filed: November 20, 2003
    Publication date: June 9, 2005
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hung-Sheng Liu, Ya-Yu Chao