Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.

Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.

Abstract: A heat dissipation assembly including a metal substrate, a heat conducting sheet and a copper foil is provided. The metal substrate has a recess defined therethrough. The heat conducting sheet has a same dimension as the recess, and is embedded in the recess. A thermal conductivity of the heat conducting sheet is greater than a thermal conductivity of the metal substrate. The copper foil is coupled to a surface of the metal substrate. A portable electronic device using the dissipation assembly is also provided. Since the heat conducting sheet has a high thermal conductivity, the metal substrate integrated with the heat conducting sheet can achieve a good strength, low weight and good heat conduct performance.

Abstract: The present invention relates to the efficient commercial synthesis of Bivalirudin.

Abstract: The present invention relates to the efficient commercial synthesis of Bivalirudin.