Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first sensing line, a second sensing line, a third sensing line, a first communication part and a second communication part. The touchpad is located over the base plate. The magnetic board is arranged between the touchpad and the magnet. The first sensing line, the second sensing line and the third sensing line of the magnetic board are in parallel with each other and stacked on each other. The first sensing line is electrically connected with the second sensing line through the first communication part. The second sensing line is electrically connected with the third sensing line through the second communication part. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibration.

Abstract: An electronic system and a security authority delegation method thereof are provided. The electronic system includes a first host device, a second host device, a first security device, and a second security device. The first security device is connected to the first host device. The second security device is connected to the second host device and the first security device. The first security device performs an attestation process on the second security device. If the second security device passes the attestation process, the first security device enables the second security device to verify executable images of the second host device. If the second security device does not pass the attestation process, the first security device disables a function of the second security device, and the function includes verifying the executable image of the second host device.

Abstract: An SOT MRAM structure includes a word line. A second source/drain doping region and a fourth source/drain doping region are disposed at the same side of the word line. A first conductive line contacts the second source/drain doping region. A second conductive line contacts the fourth source/drain doping region. The second conductive line includes a third metal pad. A memory element contacts an end of the first conductive line. A second SOT element covers and contacts a top surface of the memory element. The third metal pad covers and contacts part of the top surface of the second SOT element.

Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first sensing line, a second sensing line, a third sensing line, a first communication part and a second communication part. The touchpad is located over the base plate. The magnetic board is arranged between the touchpad and the magnet. The first sensing line, the second sensing line and the third sensing line of the magnetic board are in parallel with each other and stacked on each other. The first sensing line is electrically connected with the second sensing line through the first communication part. The second sensing line is electrically connected with the third sensing line through the second communication part. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibration.

Abstract: A touchpad module includes a base plate, a touch member, a supporting structure and a pressure sensing unit. The touch member is movable toward the base plate. The supporting structure is arranged between the base plate and the touch member. The pressure sensing unit is installed on the touch member. The pressure sensing unit is arranged between the touch member and the base plate. While the touch member is pressed in response to an external pressing force, the touch member is moved downwardly toward the base plate to compress the supporting structure. Consequently, the supporting structure is subjected to deformation, and the touch member has a displacement amount. According to the displacement amount, a magnitude of the pressing force is sensed by the pressure sensing unit, and a pressure sensing signal is outputted from the pressure sensing unit.

Abstract: An electronic system with an expansion system is provided. The electronic system includes plural electronic devices. Each electronic device includes plural connecting interfaces. The plural electronic devices are combined together through the plural connecting interfaces.

Abstract: An input system includes a first input device and a second input device. Each of the first input device and the second input device includes a main body, a first connecting port, at least two second connecting ports, a power switching circuit and a control unit. When the first connecting port of the first input device is connected with an external power source, the power switching circuit of the first input device receives a first voltage from the external power source. When one of the second connecting ports of the first input device is connected with one of the second connecting ports of the second input device, the first voltage is converted into a second voltage by the power switching circuit of the first input device and the second voltage is transmitted to the second input device.

Abstract: An input system includes a first input device and a second input device. Each of the first input device and the second input device includes a main body, a first connecting port, at least two second connecting ports, a power switching circuit and a control unit. When the first connecting port of the first input device is connected with an external power source, the power switching circuit of the first input device receives a first voltage from the external power source. When one of the second connecting ports of the first input device is connected with one of the second connecting ports of the second input device, the first voltage is converted into a second voltage by the power switching circuit of the first input device and the second voltage is transmitted to the second input device.

Abstract: A backlight kit includes a base member, a covering member, a slim-type light guide element and an illumination module. The covering member is combined with the base member. The slim-type light guide element and the illumination module are arranged between the base member and the covering member. After the illumination module emits a light beam to the slim-type light guide element, the light beam is transferred through the slim-type light guide element. Consequently, a luminance gradient region is formed on the surface of the covering member.

Abstract: A light guide structure for a backlight module is provided. A light source of the backlight module emits a light beam. The light beam is guided by the light guide structure. The light guide structure includes a plate body and a light-shielding layer. The plate body includes a light-transmissible plate, a light-guiding plate and a reflecting plate. The light-guiding plate has a lateral surface. The light-transmissible plate has a light-transmissible plate lateral surface. The reflecting plate has a reflecting plate lateral surface. The lateral surface of the light-guiding plate, the light-transmissible plate lateral surface and the reflecting plate lateral surface are collaboratively formed as a plate body lateral surface. The plate body lateral surface is covered by the light-shielding layer. The light beam from the light source is blocked by the light-shielding layer.

Abstract: A touch module includes a base plate, a magnet, a touchpad and a magnetic board. The magnetic board includes a first wiring layer, a second wiring layer and a third wiring layer. The magnet is installed on the base plate. The touchpad is located over the base plate. The magnet is covered by the touchpad. The magnetic board is arranged between the touchpad and the magnet. The first wiring layer, the second wiring layer and the third wiring layer are in parallel with each other and stacked on each other. The second wiring layer is arranged between the first wiring layer and the third wiring layer. The first wiring layer is connected with the second sensing line through the third wiring layer. The first sensing line, the second sensing line and the third sensing line sense a magnetic field of the magnet and generates a vibrating effect.

Abstract: A light source module includes a transparent conductive substrate and a light-emitting element. The light-emitting element is installed on the transparent conductive film, and electrically connected with the transparent conductive film. The light-emitting element is flip-chip LED, and/or the light-emitting element is not equipped with a lead frame. Moreover, the present invention further provides a manufacturing method of the light source module.

Abstract: A light source module includes a substrate, plural light-emitting elements and an encapsulation structure. The plural light-emitting elements are installed on the substrate. The encapsulation structure is installed on the substrate to cover the plural light-emitting elements. The encapsulation structure is made of a composition containing a polymeric glue material, a white powder material and a black powder material. In the composition, a content of the polymeric glue material is 65%˜99.8% by weight, a content of the white powder material is 0.1%˜20% by weight, and a content of the black powder material is 0.1%˜25% by weight.

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

Abstract: A semiconductor light emitting unit and a packaging method of the semiconductor light emitting unit are provided. The packaging method includes the following steps. In a step (a), a transparent substrate is provided. In a step (b), a transparent membrane circuit layer is formed on a surface of the transparent substrate. In a step (c), a semiconductor light emitting chip is formed on the transparent membrane circuit layer by a flip-chip mounting process, so that the semiconductor light emitting chip and the transparent membrane circuit layer are electrically connected with each other. In a step (d), an encapsulant is formed over the semiconductor light emitting chip to cover the semiconductor light emitting chip and a portion of the transparent membrane circuit layer. In a step (e), the encapsulant is baked.

Abstract: A cooling fan includes a fan base, an impeller part, a driving part, an illumination circuit board and plural light-emitting elements. The driving part includes a shaft seat, a driving circuit board and plural coils. The driving circuit board is disposed on the fan base. The plural coils are arranged between the driving circuit board and the illumination circuit board and arranged around the shaft seat. The rotating shaft of the impeller part is inserted into the shaft seat. When an electric current flows through the plural coils, the rotating shaft is rotated. The plural light-emitting elements are disposed on the illumination circuit board. When the electric current flows through the plural light-emitting elements, the plural light-emitting elements emit light beams.

Abstract: A light source module includes a LED die, a supporting base and an encapsulation layer. The LED die emits a light beam. The supporting base is electrically connected with the LED die, and supports the LED die. After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die. The encapsulation layer covers the LED die and a portion of the supporting base to protect the LED die. The encapsulation layer includes a light-adjusting element. A characteristic of the light beam is changed through the light-adjusting element.