Abstract: A display device includes a base layer, a touch sensing layer, a light guide module and a display panel. The touch sensing layer is disposed on the base layer. The light guide module is disposed on the touch sensing layer. The touch sensing layer is located between the light guide module and the display panel, and the touch sensing layer and one of the light guide module and the display panel have no adhesive material therebetween.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: An electronic display device includes a frame assembly, a first antenna, a display module, and a metal grounding member. The frame assembly includes a housing body, and the housing body includes an inner side surface, an outer side surface corresponding to the inner side surface, and a groove running through the outer side surface and the inner side surface. The first antenna is disposed on the inner side surface of the housing body, and the first antenna includes a grounding portion. The display module is disposed on the outer side surface of the housing body. The metal grounding member is disposed on the outer side surface of the housing body, and the metal grounding member is disposed between the housing body and the display module. The metal grounding member is coupled to the grounding portion of the first antenna through the groove.

Abstract: A headphone assembly, including: a switching element for controlling a switch of at least one functional element in a headphone; a pressure sensor accommodated in a groove of a speaker board; and an ear pad covering the groove, when the ear pad is pressed, a trigger element may be moved to press against the pressure sensor, when detecting that pressure applied by the trigger element reaches a predetermined range, the pressure sensor switches on the switching element, otherwise, the pressure sensor switches off the switching element.

Abstract: An electronic display device includes a frame assembly, a first antenna, a display module, and a metal grounding member. The frame assembly includes a housing body, and the housing body includes an inner side surface, an outer side surface corresponding to the inner side surface, and a groove running through the outer side surface and the inner side surface. The first antenna is disposed on the inner side surface of the housing body, and the first antenna includes a grounding portion. The display module is disposed on the outer side surface of the housing body. The metal grounding member is disposed on the outer side surface of the housing body, and the metal grounding member is disposed between the housing body and the display module. The metal grounding member is coupled to the grounding portion of the first antenna through the groove.

Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.

Abstract: A headphone assembly, including: a switching element for controlling a switch of at least one functional element in a headphone; a pressure sensor accommodated in a groove of a speaker board; and an ear pad covering the groove, when the ear pad is pressed, a trigger element may be moved to press against the pressure sensor, when detecting that pressure applied by the trigger element reaches a predetermined range, the pressure sensor switches on the switching element, otherwise, the pressure sensor switches off the switching element.

Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.

Abstract: The present invention discloses a handoff method of a mobile device. The mobile device is currently communicating with a wireless network via a first access point. The method includes: scanning a second access point to associate the second access point; providing a dynamic tunnel between the first access point and the second access point during handoff; utilizing the second access point, the dynamic tunnel, and the first access point to access the wireless network during handoff; authenticating the mobile device; checking a dynamic host configuration protocol (DHCP) server referred to by the second access point; and utilizing the second access point to access the wireless network after handoff.

Abstract: A method for establishing a voice over IP (VoIP) call in a wireless local-area network (WLAN) access point includes an access point receiving a first signal and forwarding the first signal to a station. After forwarding the first signal, the access point receives a request from the station. In response to the request, the access point allocates a resource for the station. Then, the access point responds to the station with a response indicating that the resource is allocated. Subsequent to the access point responding to the station, the access point receives a last signal from the station.

Abstract: A method of wireless security setup is introduced. The method includes a station transmitting a first packet containing a first SSID and related information; an access point transmitting a second packet containing the first SSID to inform that the connection between the station and the first SSID is built; the station transmitting a third packet by the connection with the first SSID to ask for an SSID other than the first SSID and related information; the access point transmitting a fourth packet containing a second SSID and the related information using the first SSID in response to the third packet; the station transmitting a fifth packet containing the second SSID and the related security information; and the access point transmitting a sixth packet containing the second SSID to inform the station that the connection between the station and the second SSID is built.