Patents by Inventor Hung Y. Chao

Hung Y. Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices and related method for the selective exposure of microencapsulated liquids
    Patent number: 5611972
    Abstract: A reusable device for exposing a microencapsulated liquid, e.g., a fragrance, comprising two surfaces adhered to each other by an adhesive composition, the adhesive composition comprising a non-film forming adhesive comprising a plurality of adhesive polymeric microparticles and microcapsules of an average diameter of about 5 .mu.m to about 60 .mu.m which have the liquid therein and which are adhered to each surface by the adhesive, wherein at least a portion of the microcapsules are broken when the surfaces are separated, and wherein the adhesive has the ability to readhere the surfaces to each other after the surfaces are separated and microcapsules broken. A method providing for the repeated, selective exposure of a microencapsulated liquid using the aforesaid device is also provided.
    Type: Grant
    Filed: May 13, 1996
    Date of Patent: March 18, 1997
    Assignee: Webcraft Technologies, Inc.
    Inventors: Christopher Tararuj, Hung Y. Chao
  • Non-silicone release polymer
    Patent number: 5393608
    Abstract: A non-silicone release material for use with pressure sensitive adhesives, which contains a copolymer of:(1) an acrylate ester of the formula I: ##STR1## wherein x ranges from about 30 to about 50; and (2) at least one comonomer selected from a vinyl monomer, an acrylate monomer or a methacrylate monomer. Preferably, the acrylate ester is about 1 to about 25% by weight of the copolymer composition. The release material can be used as a backsize for pressure sensitive adhesives, particularly repositionable labels.
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: February 28, 1995
    Assignee: Moore Business Forms
    Inventor: Hung Y. Chao
  • Pressure sensitive copying paper with repositionable adhesive properties
    Patent number: 5352648
    Abstract: A pressure sensitive carbonless copying system includes a first sheet having front and back surfaces, the back surface coated at least in part with a composition including a mixture having a pressure sensitive adhesive component and a carbonless microcapsule component; and a second sheet having front and back surfaces, the front surface coated with a carbonless image transfer material, and wherein the first sheet is temporarily adhered to the second sheet by means of the pressure sensitive adhesive component of the mixture.
    Type: Grant
    Filed: May 4, 1993
    Date of Patent: October 4, 1994
    Assignee: Moore Business Forms, Inc.
    Inventor: Hung Y. Chao
  • Pressure sensitive adhesive
    Patent number: 5314944
    Abstract: A pressure sensitive adhesive is disclosed that is tack-free to the touch, but forms a permanent bond under moderate pressure. The pressure sensitive adhesive contains a tacky adhesive latex, a non-tacky latex or polymer, and an inert filler. The tacky adhesive latex provides the sealing properties, the non-tacky latex or polymer provides blocking properties and the filler absorbs oil that may adversely affect the sealing properties. The adhesive is tack-free to the touch yet becomes activated to form a permanent bond under moderate sealing pressure.
    Type: Grant
    Filed: October 1, 1992
    Date of Patent: May 24, 1994
    Assignee: Moore Business Forms
    Inventor: Hung Y. Chao