Patents by Inventor Hura Harpreet Singh

Hura Harpreet Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7459397
    Abstract: During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to solve these problems, the present invention applies a semiconductor substrate fixing jig formed with, on the face for fixing the semiconductor substrate, a groove(s) of almost the same diameter as that of the semiconductor substrate. Semiconductor substrate damage and cracking can be suppressed by applying this jig.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: December 2, 2008
    Assignee: OpNext Japan, Inc.
    Inventors: Ryu Washino, Yasushi Sakuma, Masaru Mukaikubo, Hura Harpreet Singh, Kenji Uchida
  • Publication number: 20050250334
    Abstract: During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to solve these problems, the present invention applies a semiconductor substrate fixing jig formed with, on the face for fixing the semiconductor substrate, a groove(s) of almost the same diameter as that of the semiconductor substrate. Semiconductor substrate damage and cracking can be suppressed by applying this jig.
    Type: Application
    Filed: January 4, 2005
    Publication date: November 10, 2005
    Inventors: Ryu Washino, Yasushi Sakuma, Masaru Mukaikubo, Hura Harpreet Singh, Kenji Uchida