Patents by Inventor Hussain S. ATHAB

Hussain S. ATHAB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency transformer design for DC/DC resonant converters
    Patent number: 10832858
    Abstract: A transformer assembly includes a transformer with primary windings located on multiple layers and with secondary windings interleaved with the multiple layers and includes a substrate connected to the transformer and with a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: November 10, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Jahangir Afsharian, Bing Gong, Hussain S. Athab
  • HIGH-FREQUENCY TRANSFORMER DESIGN FOR DC/DC RESONANT CONVERTERS
    Publication number: 20180068782
    Abstract: A transformer assembly includes a transformer with primary windings located on multiple layers and with secondary windings interleaved with the multiple layers and includes a substrate connected to the transformer and with a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.
    Type: Application
    Filed: March 29, 2016
    Publication date: March 8, 2018
    Inventors: Jahangir AFSHARIAN, Bing GONG, Hussain S. ATHAB