Patents by Inventor Hussain Shaukatulla

Hussain Shaukatulla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with interconnected chips
    Patent number: 6326696
    Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: December 4, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla
  • Method of fabricating an electronic package with interconnected chips
    Patent number: 6306686
    Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: October 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla