Abstract: A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.

Abstract: The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

Abstract: A process for making mycophenolate mofetil comprising: conducting a catalytic transesterification by reacting a low-carbon alkyl ester of mycophenolic acid with 2-morpholinoethanol [also named as 4-(2-hydroxyethyl) morpholine] to obtain a crude product of mycophenolate mofetil, which is then isolated and purified.

Abstract: A track lamp assembly and a display with the track lamp assembly are described. The track lamp assembly has a track subassembly and a track lamp. The display with a track lamp assembly has a track subassembly, a support mechanism, a shelf and a track lamp. The track subassembly has a track. The track has a base. A plurality of elongate holes is defined in the base along a longitudinal direction of the track. The support mechanism is attached to some of the elongate holes of the track. The shelf is positioned at the support mechanism. The track lamp is attached to one of the elongate holes of the track, whereby the track lamp assembly is assembled to form a display. Thus, it is ready to assemble a display with a good shape.

Abstract: A process for making mycophenolate mofetil comprising: conducting a catalytic transesterification by reacting a low-carbon alkyl ester of mycophenolic acid with 2-morpholinoethanol [also named as 4-(2-hydroxyethyl) morpholine] to obtain a crude product of mycophenolate mofetil, which is then isolated and purified.

Abstract: Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers.

Abstract: A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.

Abstract: A processing and retrieving method for the characters of a character language to/from a memory device. The character is built-up with at least one unit or root. The method comprises the steps of designating the first stroke of the unit with a first number, designating the last stroke of the unit with a number, assembling a numerical group for the character from the numbers, and using the groups to process or retrieve the character to/from the memory device.

Abstract: The present invention is a process for the liquefaction of high pressure natural gas. The natural gas is expanded through a turboexpander to reduce its pressure and thereby cool it. The natural gas is then passed through a demethanizer to remove the heavier components therefrom. The natural gas is then precooled, before substantial warming occurs, by heat exchange with a C.sub.2 hydrocarbon refrigerant, either ethane or ethylene, contained in a single refrigerant system. The precooled natural gas is liquefied by heat exchange with a mixed refrigerant contained in a mixed refrigerant system. The mixed refrigerant consists essentially of nitrogen, methane and a C.sub.2 hydrocarbon, either ethane or ethylene. The mixed refrigerant contained in the mixed refrigerant system is cooled by heat exchange with the C.sub.2 hydrocarbon refrigerant contained in the single refrigerant system.

Abstract: A process is disclosed for producing a purified liquefied natural gas (LNG) from a raw natural gas feed containing methane and hydrocarbon impurities of C.sub.2 and higher wherein the raw feed is cooled, distilled to remove impurities, and liquefied, such that the distillation reflux is supplied by a portion of a subcooled methane-rich liquid stream exiting the middle bundle of a three bundle main cryogenic heat exchanger having a mixed cryogenic refrigerant. The raw feed is cooled in the first bundle of said main exchanger.