Patents by Inventor Hwa Seob CHOI

Hwa Seob CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device
    Patent number: 9558979
    Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: January 31, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwa Seob Choi, Yu Sung Jang, Tai Young Eum, Jee Ho Lee
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20140319784
    Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.
    Type: Application
    Filed: October 4, 2013
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwa Seob CHOI, Yu Sung JANG, Tai Young EUM, Jee Ho LEE