Abstract: A method of manufacturing a solar cell includes providing a semiconductor substrate; disposing a reflection layer on one side of the semiconductor substrate, wherein the disposing the reflection layer comprises implanting gas into a surface of the one side of the semiconductor substrate and heating the gas; disposing an n+ region and a p+ region separated from each other on the other opposite facing side of the semiconductor substrate; disposing a first electrode connected to the n+ region; and disposing a second electrode connected to the p+ region.

Abstract: A method of manufacturing a solar cell includes providing a semiconductor substrate; disposing a reflection layer on one side of the semiconductor substrate, wherein the disposing the reflection layer comprises implanting gas into a surface of the one side of the semiconductor substrate and heating the gas; disposing an n+ region and a p+ region separated from each other on the other opposite facing side of the semiconductor substrate; disposing a first electrode connected to the n+ region; and disposing a second electrode connected to the p+ region.

Abstract: A solar cell module includes a plurality of solar cells connected to each other, each solar cell of the plurality of solar cells independently includes a semiconductor substrate, one n+ region and one p+ region disposed on one side of the semiconductor substrate and separated from each other, at least one first electrode and at least one second electrode, in which the at least one first electrode is electrically connected to the n+ region and the at least one second electrode is electrically connected to the p+ region, and a first trench and a second trench disposed on each of the plurality of solar cells, wherein the first trench is disposed on the one side of the semiconductor substrate and the second trench is disposed on the other opposite facing side of the semiconductor substrate, the first and second trenches are separated from each other.

Abstract: A solar cell includes; a semiconductor substrate, an n+ region disposed on a surface of the semiconductor substrate, a plurality of first electrodes connected to the n+ region, a p+ region disposed on the surface of the semiconductor substrate and separated from the n+ region, a second electrode connected to the p+ region, and a first dielectric layer which has a positive fixed charge and is disposed between adjacent first electrodes of the plurality of first electrodes, and a method of manufacturing the same.

Abstract: A solar cell includes a semiconductor substrate, an n+ region and a p+ region disposed on the semiconductor substrate, a first electrode electrically connected to the n+ region, and a second electrode electrically connected to the p+ region. A trench formed in the semiconductor substrate separates the n+ region from the p+ region.

Abstract: A solar cell includes a semiconductor substrate having a plurality of contact holes penetrating therethrough, from one surface to the opposing surface and including a part having a first conductive layer selected from p-type and n-type and a part having a second conductive layer different from the first conductive layer and selected from p-type and n-type semiconductor, a first electrode formed on one surface of the semiconductor substrate and electrically connected with the part having the first conductive layer, a second electrode formed on the other surface of the semiconductor substrate and electrically connected with the first electrode, and a third electrode formed on the same surface as in the second electrode and electrically connected with the part having the second conductive layer of the semiconductor substrate, wherein the plurality of contact holes form a contact hole group, and the first electrode and the second electrode are connected through one or more of the plurality of contact holes of the

Abstract: Disclosed are a semiconductor device and a related method of manufacture. The semiconductor device comprises a semiconductor substrate, a conductive structure including contact regions and gate structures formed on the semiconductor substrate, a protection layer formed on the gate structures, an insulation layer formed on the protection layer, and a plurality of contacts directly contacting the contact regions and the semiconductor substrate through the insulation layer, wherein the contacts have substantially different heights from each other.

Abstract: A method of forming a ferroelectric device includes forming a ferroelectric pattern on a substrate, the ferroelectric pattern including a ferroelectric material including titanium and oxygen, forming an insulating layer on the ferroelectric pattern, and planarizing the insulating layer using a slurry until the ferroelectric pattern is exposed, wherein the ferroelectric pattern serves as a polishing stop pattern and the slurry includes ceria.

Abstract: In a method of manufacturing a ferroelectric capacitor, a lower electrode layer is formed on a substrate. The lower electrode layer includes at least one lower electrode film. A ferroelectric layer is formed on the lower electrode layer, and then an upper electrode layer is formed on the ferroelectric layer. A hard mask structure is formed on the upper electrode layer. The hard mask structure includes a first hard mask and a second hard mask. An upper electrode, a ferroelectric layer pattern and a lower electrode are formed by partially etching the upper electrode layer, the ferroelectric layer and the lower electrode layer using the hard mask structure. The hard mask structure may prevent damage to the ferroelectric layer and may enlarge an effective area of the ferroelectric capacitor so that the ferroelectric capacitor may have enhanced electrical and ferroelectric characteristics.

Abstract: Disclosed are a semiconductor device and a related method of manufacture. The semiconductor device comprises a semiconductor substrate, a conductive structure including contact regions and gate structures formed on the semiconductor substrate, a protection layer formed on the gate structures, an insulation layer formed on the protection layer, and a plurality of contacts directly contacting the contact regions and the semiconductor substrate through the insulation layer, wherein the contacts have substantially different heights from each other.