Patents by Inventor Hwan Kang

Hwan Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11998409
    Abstract: The present invention relates to a method of manufacturing a dental composite blank, including (a) placing a composite paste in a mold, (b) pressurizing the composite paste placed in the mold at a first pressure (P1), (c) pressurizing the composite paste placed in the mold at a second pressure (P2), and (d) curing the pressurized composite paste, in which each of steps (b) and (c) is performed once or multiple times, and the first pressure (P1) is less than or greater than the second pressure (P2). The dental composite blank and the method of manufacturing the same are effective at dispersing a non-dispersed filler and removing bubbles, thus improving mechanical properties, through repeated pressurization at different pressures before curing the composite paste.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: June 4, 2024
    Assignee: VERICOM CO., LTD.
    Inventors: Myung-Hwan Oh, Jong-Ho Kang, Hyun-Chul Yoo, Joung-Lim Hoo, Yun-Ki Kim
  • Patent number: 12002962
    Abstract: Disclosed is a method for manufacturing a dry electrode. The method allows determination of the micro-fibrilization degree of a binder resin from the crystallinity of the binder resin. Based on this, the processing conditions of mixed powder for electrode or an electrode film may be controlled. In this manner, it is possible to check and control the processing conditions easily and efficiently. In addition, the method for manufacturing a dry electrode includes a kneading step using a kneader under a low speed and high temperature and pulverization step. Therefore, there is no problem of blocking of a flow path caused by aggregation of the ingredients, which is favorable to mass production.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: June 4, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Seong-Wook Kang, Jae-Sung Han, Dong-Mok Shin, Dong-Oh Shin, Kyung-Hwan Yoon, Kwang-Ho Yoo
  • Patent number: 12000008
    Abstract: The present disclosure relates to a high-strength hot-dip galvanized steel sheet having excellent surface quality and electrical resistance spot weldability, and a method for manufacturing the same. A galvanized steel sheet according to an aspect of the present disclosure is a galvanized steel sheet including a base steel sheet and a zinc-based plating layer formed on a surface of the base steel sheet, wherein a ratio (a/b) of a hardness of a surface layer portion (a) to a hardness of an internal portion (b) of the base steel sheet may be less than 0.95.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 4, 2024
    Assignee: POSCO
    Inventors: Ki-Cheol Kang, Chung-Hwan Lee, Yong-Joo Kim, Kang-Min Lee, Kyoo-Young Lee
  • Patent number: 11999879
    Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at ?20° C. of about 50 ?m to about 100 ?m and a gel fraction of about 50% to about 75%.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: June 4, 2024
    Assignees: Samsung SDI Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Ik Hwan Cho, Ji Ho Kim, Jee Hee Kim, Ji Won Kang, Byeong Do Kwak, Yong Tae Kim, Il Jin Kim, Sung Hyun Mun, Hyung Rang Moon, Seon Hee Shin, Gwang Hwan Lee, Woo Jin Lee, Jae Hyun Han
  • Publication number: 20240178188
    Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.
    Type: Application
    Filed: August 1, 2023
    Publication date: May 30, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Myung-Sung KANG, Kyong Hwan KOH, Jin-Woo PARK, Chung Sun LEE, Hyeon Jun JIN
  • Patent number: 11991902
    Abstract: A display device includes a bank including an opening exposing a surface of a base. The bank further includes side surfaces adjacent to an upper surface. The side surfaces slope downward from the upper surface toward an opening in an organic film pattern. A plurality of fine holes is formed on the upper surface and the side surfaces, the bank may also include a plurality of inner holes.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: May 21, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung Hwan Kim, Suk Hoon Kang, Min Jae Kim, Hee Ra Kim, Beom Soo Shin, Hong Yeon Lee, Baek Kyun Jeon
  • Patent number: 11991878
    Abstract: A semiconductor device include a nonvolatile memory device, including a first well region formed in a substrate, a tunneling gate insulator formed on the first well region, a floating gate formed on the tunneling gate insulator, a control gate insulator formed on the substrate, a control gate formed on the control gate insulator, and a first source region and a first drain region formed on opposite sides of the control gate, respectively, and a first logic device, including a first logic well region formed in the substrate, a first logic gate insulator formed on the first logic well region, a first logic gate formed on the first logic gate insulator, wherein the first logic gate comprises substantially a same material as a material of the control gate of the nonvolatile memory device.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: May 21, 2024
    Assignee: SK keyfoundry Inc.
    Inventors: Kwang Il Kim, Yang Beom Kang, Jung Hwan Lee, Min Kuck Cho, Hyun Chul Kim
  • Patent number: 11991150
    Abstract: Disclosed herein are an apparatus and method for providing a remote work environment. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program performs Virtual Private Network (VPN) authentication in response to a request for remote access to a work network from a user terminal, performs user authentication in order to connect the user terminal that succeeds in VPN authentication to the work network, decrypts the encrypted user data area of the user terminal that is connected to the work network, and provides the remote work environment to the user terminal based on the user data area through the work network.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 21, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gak-Soo Lim, Sung-Jin Kim, Jung-Hwan Kang, Seung-Hun Han, Byung-Joon Kim
  • Publication number: 20240158705
    Abstract: The present disclosure provides a method and device for refining waste plastic pyrolysis oil, the method including (S1) subjecting a waste plastic pyrolysis oil feedstock to a heat treatment by charging the waste plastic pyrolysis oil feedstock into a rotary kiln reactor and increasing a temperature of the rotary kiln reactor to form a product; (S2) recovering a gas component from the product of step (S1); (S3) separating a high boiling point wax component from the recovered gas component and re-supplying the separated high boiling point wax component to the rotary kiln reactor in step (S1); and (S4) recovering refined oil from the gas component from which the high boiling point wax component is removed.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Sang Hwan Jo, Soo Kil Kang, Ik Hwan Na, Ho Won Lee, Jae Heum Jung, Se Rah Moon, Hee Young Jeon
  • Patent number: 11981973
    Abstract: The present disclosure relates to a zinc plated steel sheet having excellent fatigue strength of electrical resistance spot welds and a method for manufacturing the same. According to an aspect of the present disclosure, a zinc plated steel sheet includes a base steel sheet and a zinc-based plating layer formed on a surface of the base steel sheet, wherein a concentration profile of one or two of oxygen, and silicon and manganese measured in a depth direction from the surface of the base steel sheet has a maximum point in the depth direction from the surface, and an absolute value of a difference between a depth at which the maximum point of the concentration profile of oxygen is formed and a depth at which the maximum point of the concentration profile of one of silicon and manganese is formed is 0.5 ?m or less.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: May 14, 2024
    Assignee: POSCO
    Inventors: Ki-Cheol Kang, Chung-Hwan Lee
  • Publication number: 20240149751
    Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: Jae Wook Kim, Sang Soo Lee, Deok Soo Lim, Hyun Wook Lim, Sang Ho Lee, Sang Hark Lee, Hak Cheol Lee, Deok Ki Kim, Byeong Deok Choi, Hoe Cheon Kim, Hwa Young Mun, Seung Yeop Lee, Cheol Hwan Yoon, Jung Bin Lee, Byung Ju Kang
  • Publication number: 20240140822
    Abstract: A water purifier is provided. A water purifier according to one aspect of the present invention may include a housing having a first accommodation space therein, and made of a paper material; a water purifier faucet disposed in the first accommodation space to receive raw water and discharge purified water; and a filter coupled to the water purifier faucet to generate the purified water by filtering the raw water, wherein the water purifier faucet includes a base frame having a second accommodation space therein in which the filter is accommodated; a water inlet module provided on one side of the base frame to supply raw water introduced from the outside to the filter; and a water outlet module provided on the other side of the base frame to receive the purified water generated by the filter and discharge it to the outside.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Applicant: COWAY Co., Ltd.
    Inventors: Eui Hwan LEE, Chan Jung PARK, Jun HER, Myeong Hoon KANG, Gyeong Cheol SIN, Sang Gu SIM
  • Publication number: 20240145913
    Abstract: The present disclosure relates to a phase shifter and a communication device including the same, and particularly, to a phase shifter including a base panel; a fixed substrate which is laminated and fixed on one side or another side on the base panel and has a plurality of circuit patterns printed on the top surface thereof; and a phase shift switching part provided with a plurality of movable substrates including movable strip terminal which are in contact with the plurality of circuit patterns of the fixed substrate, wherein the phase shift switching part is configured to reciprocate the plurality of movable substrates within a predetermined distance in a horizontal direction on the base panel to change the positions of contact points of the movable substrates with respect to the circuit patterns, wherein the phase shift switching part moves the plurality of movable substrates while elastically supporting the plurality of movable substrates toward the circuit patterns, thereby providing an advantage of maxi
    Type: Application
    Filed: January 7, 2024
    Publication date: May 2, 2024
    Applicant: KMW INC.
    Inventors: Sung Hwan SO, Oh Seog CHOI, Seong Man KANG, Hyoung Seok YANG, Yong Won SEO, Cha Gun GANG
  • Publication number: 20240145483
    Abstract: A display device includes a substrate, a semiconductor layer disposed on the substrate, and including a first channel portion, a second channel portion, a connecting portion disposed between the first channel portion and the second channel portion, and electrode regions, a first insulating layer disposed on the semiconductor layer, a gate conductor disposed on the first insulating layer and including a first gate electrode overlapping the first channel portion and a second gate electrode overlapping the second channel portion, signal lines disposed on the substrate, a first electrode electrically connected to at least one of electrode regions of the semiconductor layer, an emission layer disposed on the first electrode, and a second electrode disposed on the emission layer, and the first channel portion and the second channel portion of the semiconductor layer each have a first width greater than a second width of the connecting portion.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Han Bit KIM, Mee Jae KANG, Keun Woo KIM, Doo-Na KIM, Sang Sub KIM, Do Kyeong LEE, Jae Hwan CHU
  • Publication number: 20240145939
    Abstract: A dual polarization antenna is disclosed in at least one embodiment of the present disclosure, including a base substrate, a power feeding unit supported on the base substrate, and a radiating plate supported on the power feeding unit, the power feeding unit includes a first feeding substrate and a second feeding substrate arranged to cross each other on the base substrate, the first feeding substrate includes a first feed line configured to supply a first reference phase signal to a first point on the radiating plate and to supply a first reverse phase signal having a reverse phase relative to the first reference phase signal, to a second point on the radiating plate, the second feeding substrate includes a second feed line configured to supply a second reference phase signal to a third point on the radiating plate and to supply a second reverse phase signal having a reverse phase relative to the second reference phase signal, to a fourth point on the radiating plate, and wherein the first feeding substrate
    Type: Application
    Filed: December 15, 2023
    Publication date: May 2, 2024
    Applicant: KMW INC.
    Inventors: Sung Hwan SO, Oh Seog CHOI, Seong Man KANG, Yong Won SEO, Myung Hwa KIM, Su Yong LEE
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Patent number: 11970700
    Abstract: The present invention relates to an intracellular expression enhancing genetic element, which enhances the intracellular expression of target protein encoded in RNA therapeutics such as mRNA vaccines and RNA medicines. In more detail, the present invention relates to the RNA molecule which has the genetic element capable of enhancing the intracellular expression of target protein encoded in RNA therapeutics delivered into cells; the plasmid used to synthesize the RNA molecule having the genetic element “E3”; the method for synthesizing RNA molecule having the genetic element “E3” using the plasmid and utilizing the synthesized RNA molecule as RNA therapeutics.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: April 30, 2024
    Assignee: Intron Biotechnology, Inc.
    Inventors: Seong Jun Yoon, An Sung Kwon, Se Hwan Kim, Sang Hyeon Kang
  • Publication number: 20240136488
    Abstract: A pixel may include: an emission area and a non-emission area; a first bank in the non-emission area, the first bank including an opening corresponding to the emission area; a first electrode, a second electrode, and an intermediate electrode that are spaced from each other; light emitting elements in the emission area, each of the light emitting elements including one end portion electrically connected to one of the first electrode, the second electrode, or the intermediate electrode and an other end portion electrically connected to another one of the first electrode, the second electrode, or the intermediate electrode; and a sub-bank located in the opening of the first bank, the sub-bank being spaced from the first bank. The intermediate electrode may be around at least a portion of the sub-bank.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Inventors: Jin Taek KIM, Veidhes BASRUR, Ki Nyeng KANG, Ock Soo SON, Yong Tae CHO, Jong Hwan CHA
  • Patent number: D1025167
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu
  • Patent number: D1025168
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu