Patents by Inventor HWANGSOO PARK

HWANGSOO PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for treating substrate
    Patent number: 10991601
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 27, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Hwangsoo Park, Jun Ho You, Doo Young Oh, Jaehun Jeong
  • Apparatus and method for treating substrate
    Patent number: 10969700
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: April 6, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Hwangsoo Park, Jun Ho You
  • APPARATUS AND METHOD FOR TREATING SUBSTRATE
    Publication number: 20200027761
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
    Type: Application
    Filed: July 18, 2019
    Publication date: January 23, 2020
    Inventors: HWANGSOO PARK, JUN HO YOU, DOO YOUNG OH, JAEHUN JEONG
  • APPARATUS AND METHOD FOR TREATING SUBSTRATE
    Publication number: 20200026205
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 23, 2020
    Inventors: HWANGSOO PARK, JUN HO YOU